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A Programmable Terahertz Metasurface With Circuit-Coupled Meta-Elements in Silicon Chips: Creating Low-Cost, Large-Scale, Reconfigurable Terahertz Metasurfaces
IEEE Antennas and Propagation Magazine ( IF 3.5 ) Pub Date : 2022-06-14 , DOI: 10.1109/map.2022.3176588
Suresh Venkatesh 1 , Xuyang Lu 2 , Hooman Saeidi 1 , Kaushik Sengupta 1
Affiliation  

As we step into a world of ubiquitous connectivity, a spectral regime-spanning, 30−300+-GHz resource is opening up that will serve as the fabric for wireless sensing and communication coexistence, allowing high-resolution sensing (imaging, gesture recognition, and localization) and enabling a network of unmanned and autonomous systems to understand and interact with our environment. This pushes the need for low-profile, low-cost, low-power, high-performance, secure, multifunctional electromagnetic (EM) platforms that can enable such wireless systems. In this article, we present a new circuit-coupled active meta-element design to demonstrate reconfigurable, multifunctional terahertz (THz) holographic metasurfaces with tiled silicon chips. Each such chip consists of a ${12}\,{\times}\,{12}$ array of meta-elements that are individually addressable and reconfigurable at gigahertz (GHz) speed.

中文翻译:

在硅芯片中具有电路耦合元元件的可编程太赫兹超表面:创建低成本、大规模、可重构的太赫兹超表面

随着我们步入一个无处不在的连接世界,一个跨越频谱范围的 30-300+-GHz 资源正在开放,它将作为无线传感和通信共存的结构,实现高分辨率传感(成像、手势识别、和本地化),并使无人驾驶和自主系统网络能够理解我们的环境并与之交互。这推动了对能够支持此类无线系统的薄型、低成本、低功耗、高性能、安全、多功能电磁 (EM) 平台的需求。在本文中,我们提出了一种新的电路耦合有源元元件设计,以展示具有平铺硅芯片的可重构、多功能太赫兹 (THz) 全息超表面。每个这样的芯片由一个${12}\,{\次}\,{12}$以千兆赫 (GHz) 速度可单独寻址和重新配置的元元素阵列。
更新日期:2022-06-14
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