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Thermoelectric coolers for on-chip thermal management: Materials, design, and optimization
Materials Science and Engineering: R: Reports ( IF 31.0 ) Pub Date : 2022-08-17 , DOI: 10.1016/j.mser.2022.100700
Wen-Yi Chen, Xiao-Lei Shi, Jin Zou, Zhi-Gang Chen

Compared with traditional active cooling methods, thermoelectric coolers are more accessible to be integrated with electronics as an effective thermal management solution due to their reliability, silence, compatibility, and controllability. Considering the rapid development of processors and chips in electronics, this work comprehensively reviews the progress of state-of-the-art on-chip thermoelectric coolers and summarizes the related fundamentals, materials, designs, and system logic. Particularly, we highlight on-chip thermoelectric coolers with self-cooling design and on-demand requirement. In the end, we point out current challenges and opportunities for future improvement of designs, performance, and applications of on-chip thermoelectric coolers.



中文翻译:

用于片上热管理的热电冷却器:材料、设计和优化

与传统的主动冷却方法相比,热电冷却器由于其可靠性、静音性、兼容性和可控性,更易于与电子设备集成,作为一种有效的热管理解决方案。考虑到电子领域处理器和芯片的快速发展,本工作全面回顾了最先进的片上热电冷却器的进展,并总结了相关的基本原理、材料、设计和系统逻辑。特别是,我们重点介绍了具有自冷却设计和按需需求的片上热电冷却器。最后,我们指出了未来改进片上热电冷却器的设计、性能和应用的当前挑战和机遇。

更新日期:2022-08-18
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