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Machining Stability Research of Soft-Brittle Crystals Lapping by Fixed-Abrasive Pad
Integrated Ferroelectrics ( IF 0.7 ) Pub Date : 2022-07-28 , DOI: 10.1080/10584587.2022.2074222
Zhu Nan-nan, Zhao Si-long, Zhang Sheng-bin, Niu Feng-li, Zhu Yong-wei

Abstract

Fixed-abrasive (FA) lapping and polishing process is the main approach to realize the residual-free and low damage processing of soft-brittle crystals. The hardness of matrix and the abrasive micro-fragmentation are the key parameters impacting the stability of the continuous batch machining. The FA pads were prepared with hard and soft matrix, respectively, and the single diamond (SD) and the aggregated diamond (AD) were mixed in the FA pads, respectively. The FA lapping tests were carried out with LN wafers under the applied load of 10.5 kPa. The continuous batch machining stability of four pads tests were evaluated by the evaluation indexes of the material removal rate (MRR), surface roughness Ra and the material removal rate variation (MRRV). The workpiece surface morphology and abrasive wear pattern were analyzed. The results indicate that: hard matrix is not conducive to the shedding and replacement of abrasive grains because of the high holding force, causing a MRRV of 50%. The MRR of the hard matrix pad tests signally decrease from 3.71 μm/min to 1.9 μm/min. By contrast, the low hardness matrix pad can be applied to improve the machining efficiency owing to its MRRV only about 30%. The MRR of the AD pad is over 600 nm/min, which is far more than that of the SD pad, and the MRRV of the AD pad is just about 20%. While MRRV of the SD pad is as high as 75% with the remarkably decline of MRR. At the view of Ra values, the SD pad and the AD pad both attain nanoscale. The Ra values of the SD pad tests are smaller and the workpiece are superior in surface quality. In the rough lapping and fine lapping stage, the SD can be used to prepare FA pad to improve lapping stability.



中文翻译:

固定磨盘研磨软脆晶体的加工稳定性研究

摘要

固定磨具(FA)研磨抛光工艺是实现软脆晶体无残留、低损伤加工的主要途径。基体硬度和磨料微碎度是影响连续批量加工稳定性的关键参数。FA 垫分别用硬质和软质基质制备,单颗金刚石 (SD) 和聚集金刚石 (AD) 分别混合在 FA 垫中。FA 研磨测试是在 10.5 kPa 的施加载荷下使用 LN 晶片进行的。通过材料去除率(MRR)、表面粗糙度Ra和材料去除率变化(MRRV)等评价指标评价了四块焊盘的连续批量加工稳定性。分析了工件表面形貌和磨粒磨损规律。结果表明:硬质基体由于保持力大,不利于磨粒的脱落和置换,导致 MRRV 为 50%。硬矩阵焊盘测试的 MRR 从 3.71 μm/min 显着降低到 1.9 μm/min。相比之下,低硬度矩阵垫可用于提高加工效率,因为它的 MRRV 仅为 30% 左右。AD pad 的 MRR 超过 600 nm/min,远远超过 SD pad,而 AD pad 的 MRRV 仅为 20% 左右。而SD pad的MRRV高达75%,MRR显着下降。从 Ra 值来看,SD 焊盘和 AD 焊盘都达到了纳米级。SD焊盘测试的Ra值较小,工件表面质量较好。在粗研磨和精研磨阶段,SD可用于制备FA垫,以提高研磨稳定性。

更新日期:2022-07-29
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