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Experimental Research on Chip Morphology of Ti-5553 Cutting under High-Pressure Cooling
Integrated Ferroelectrics ( IF 0.7 ) Pub Date : 2022-07-28 , DOI: 10.1080/10584587.2022.2074224
Liang Wang 1 , Rongyi Li 1 , Erliang Liu 1 , Hongyan Zhang 1
Affiliation  

Abstract

Because Ti-5553 is a kind of difficult-to-machining material, this study uses high-pressure cooling to assist machining and compares it with dry cutting to observe the change of chip morphology in the cutting process. Firstly, a comparative analysis of the chip's macroscopic morphology is carried out, and then the microscopic morphology difference of the chip and its influence on the macroscopic morphology are explored. Furthermore, it provides an intuitive basis for evaluating the cutting performance of Ti-5553 under high-pressure cooling. Experimental research shows that the chips generated under high-pressure cooling are more conducive to chip breaking.



中文翻译:

高压冷却下Ti-5553切削的切屑形貌实验研究

摘要

由于Ti-5553是一种难加工材料,本研究采用高压冷却辅助加工,并与干切削进行对比,观察切削过程中切屑形态的变化。首先对芯片的宏观形貌进行对比分析,然后探讨芯片的微观形貌差异及其对宏观形貌的影响。此外,它为评估 Ti-5553 在高压冷却下的切削性能提供了直观的依据。实验研究表明,高压冷却下产生的切屑更有利于断屑。

更新日期:2022-07-29
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