A dense and uniform W-15Cu composite material was successfully prepared by adding different amounts of silver as the active agent followed by direct sintering and infiltration. The effects of silver additive content on the microstructure and properties of W-15Cu composites under the prefabricated tungsten skeleton re-osmosis copper process and direct sintering infiltration were studied by scanning electron microscopy (SEM), X-ray diffractometer and laser thermal conductivity analyzer. When using direct infiltration sintering, adding an appropriate amount of silver eliminated pores and promoted densification, thereby increasing the relative density of tungsten copper composites. When the silver content was 2.0 wt%, the relative density was 96.58%, the thermal conductivity was up to 203.43 W/m.K, and the conductivity was 31.2% IACS. Compared with the W-15Cu composite material (26.4% IACS) prepared at the same process temperature, the conductivity of W-2.0Ag13Cu was increased by about 18.2%, and the Vickers hardness was 262 HV. The fracture morphology analysis of the tungsten‑copper composites showed that the addition of Ag enhanced the interfacial bonding of the sintered composite materials and formed an ideal tungsten‑copper network structure. The fracture modes were the ductile fracture of the Cu-Ag matrix and the brittle fracture of the W phase.

通过添加不同量的银作为活性剂，直接烧结渗透，成功制备了致密均匀的W-15Cu复合材料。采用扫描电子显微镜(SEM)、X射线衍射仪和激光热导分析仪研究了银添加剂含量对预制钨骨架再渗透铜工艺和直接烧结熔渗工艺下W-15Cu复合材料显微组织和性能的影响。采用直接渗透烧结法时，加入适量银可消除气孔，促进致密化，从而提高钨铜复合材料的相对密度。当银含量为2.0 wt%时，相对密度为96.58%，热导率高达203.43 W/mK，电导率为31.2% IACS。与相同工艺温度下制备的W-15Cu复合材料（26.4% IACS）相比，W-2.0Ag13Cu的电导率提高了约18.2%，维氏硬度为262 HV。钨铜复合材料的断口形貌分析表明，Ag的加入增强了烧结复合材料的界面结合，形成了理想的钨铜网络结构。断裂模式为Cu-Ag基体的韧性断裂和W相的脆性断裂。钨铜复合材料的断口形貌分析表明，Ag的加入增强了烧结复合材料的界面结合，形成了理想的钨铜网络结构。断裂模式为Cu-Ag基体的韧性断裂和W相的脆性断裂。钨铜复合材料的断口形貌分析表明，Ag的加入增强了烧结复合材料的界面结合，形成了理想的钨铜网络结构。断裂模式为Cu-Ag基体的韧性断裂和W相的脆性断裂。