The transfer of heat energy in organic semiconductors (OSCs) plays an important role in advancing the applications of organic electronics, especially for lifetime issues. However, compared with crystalline inorganic semiconductors, the thermal transport of OSCs is less efficient and a relevant understanding is very limited. In this contribution, we show that the heat conduction of OSCs can be enhanced by blending with a “commodity” insulator (both thermal and electrical). PC₇₁BM, a well-known electron transporter but poor thermal conductor, was selected as the host OSC material. The blending of a small amount of polystyrene (PS), a commonly used insulating polymer, can facilitate the heat transfer of PC₇₁BM films, as substantiated by the scanning photothermal deflection technique and an infrared thermal camera. The phase thermodynamics of PC₇₁BM/PS blends indicates that the efficient heat transfer preferably occurs in the OSC/insulator blends with better intimate mixing, where isolated PC₇₁BM domains can be effectively bridged by PS that thread through the regions. The applicability of this approach can be observed in blends with another host material─ITIC. This work provides a facile strategy for designing thermally durable organic electronic devices.

中文翻译：

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通过绝缘体混合方法增强 n 型有机半导体的传热

有机半导体 (OSC) 中的热能传递在推进有机电子产品的应用方面发挥着重要作用，尤其是在寿命问题方面。然而，与晶体无机半导体相比，OSCs的热传输效率较低，相关认识非常有限。在此贡献中，我们表明 OSC 的热传导可以通过与“商品”绝缘体（热和电）混合来增强。PC ₇₁ BM 是一种众所周知的电子传输体，但导热性较差，被选为 OSC 的主体材料。少量共混聚苯乙烯（PS），一种常用的绝缘聚合物，可以促进PC _71的传热BM 胶片，由扫描光热偏转技术和红外热像仪证实。_{PC 71} BM/PS 共混物的相热力学表明，有效的热传递最好发生在 OSC/绝缘体共混物中，具有更好的紧密混合，其中孤立的 PC ₇₁ BM 域可以通过穿过这些区域的 PS 有效地桥接。这种方法的适用性可以在与另一种主体材料——ITIC 的混合物中观察到。这项工作为设计耐热有机电子器件提供了一种简便的策略。