Thermogravimetric analysis (TGA) is a widely applied classic method for material characterization. However, the existing TGA method has reached its technical ceiling in regard to its sensitivity, efficiency, application scope, and extensibility. With temperature-programming and a picogram (10^–12 g) mass resoluble measurement function, an integrated resonant microcantilever is proposed and developed into micro-electromechanical system-based TGA (MEMS TGA) technology to satisfy the significantly higher TGA requirements. With only a nanogram (10^–9 g) level of a loaded sample, the microcantilever can conduct ultrasensitive mass-loss analysis along with ultrafast and controllable heating up to 1200 °C. Experiments have verified that MEMS TGA can improve heating efficiency by at least one order of magnitude compared to conventional TGA while maintaining measurement accuracy. The trace sample requirement also enables MEMS TGA to directly test explosive substances in an air atmosphere, while conventional TGA with a larger amount of sample has difficulty in avoiding explosion-induced equipment damage during heating. The silicon MEMS TGA microchip also exhibits functional combination (even integration) with other analytical techniques such as Raman spectroscopy to realize operando characterization.

中文翻译：

---

共振微悬臂梁的热重分析

热重分析 (TGA) 是一种广泛应用的经典材料表征方法。然而，现有的TGA方法在灵敏度、效率、应用范围和可扩展性方面已经达到了技术上限。具有程序升温和皮克（10-12 ^g）质量可溶性测量功能，提出了一种集成谐振微悬臂梁，并将其发展为基于微机电系统的TGA（MEMS TGA）技术，以满足显着更高的TGA要求。只有一纳克 (10 ^–9g) 加载样品的水平，微悬臂梁可以进行超灵敏的质量损失分析以及高达 1200 °C 的超快和可控加热。实验证明，与传统TGA相比，MEMS TGA可以在保持测量精度的同时，将加热效率提高至少一个数量级。微量样品要求也使MEMS TGA能够直接测试空气气氛中的爆炸性物质，而样品量较大的传统TGA难以避免在加热过程中因爆炸引起的设备损坏。硅 MEMS TGA 微芯片还展示了与拉曼光谱等其他分析技术的功能组合（甚至集成），以实现操作数表征。