Microchannel heat sinks have been widely used in high-density packaged electronic device cooling technology. We combined the cantor fractal structure with the microchannel heat sink to design a new type of microchannel structure. Combining fractal structure with microchannel heat sink is one of the cutting-edge technologies of heat transfer to solve the heat dissipation problem of high heat flux electronic equipment. We chose the width-to-height ratio of the microchannel inlet (a/b), the width-to-height ratio of the Cantor fractal baffle (B/h) and the ratio of the microchannel inlet width and the distance between each group of baffles (a/λ) as design variables, and the optimization objective was to make the global thermal resistance and pump work minimum. First, the pressure drops, temperature, and velocity of the microchannel heat sink were analyzed. Then, to consider the fluid heat transfer and pressure drop comprehensively, the enhanced heat transfer factor PEC was used to evaluate the comprehensive heat transfer performance of the microchannel. The final optimized structure PEC values were all greater than 1. In the Reynolds number (Re) range of 100–500, its enhanced heat transfer factor PEC is 1.56–1.79, which indicates that the heat transfer effect of the optimized microchannel heat sink is greatly enhanced than that of the conventional microchannel.

微通道散热器已广泛应用于高密度封装电子器件冷却技术。我们将康托尔分形结构与微通道散热器相结合，设计了一种新型微通道结构。将分形结构与微通道散热器相结合是解决高热通量电子设备散热问题的传热前沿技术之一。我们选择了微通道入口的宽高比（a/b）、Cantor分形挡板的宽高比（B/h）以及微通道入口宽度与各组间距离的比值挡板数 (a/ λ) 作为设计变量，优化目标是使全局热阻和泵工作最小。首先，分析了微通道散热器的压降、温度和速度。然后，综合考虑流体传热和压降，采用增强传热系数PEC来评价微通道的综合传热性能。最终优化后的结构PEC值均大于1。在雷诺数（Re）100~500范围内，其增强传热系数PEC为1.56~1.79，说明优化后微通道散热器的传热效果为比传统的微通道大大增强。