A high-integration and low-cost transmitter packaging solution for 0.2-THz system-in-package (SiP) application is newly presented using high-temperature co-fired ceramic (HTCC) technology. To improve 3-D integration, internal vertical air-filled interconnection waveguides buried in the HTCC package are explored and fabricated. A compact MoCu waveguide bandpass filter (BPF) is designed and integrated into the package to suppress the harmonic output of the mixer. To demonstrate the potential SiP application in the future 0.2-THz radar systems, based on the proposed solution, two 0.2-THz transmitters using frequency multipliers/mixer are designed, fabricated, and measured. All the components are buried in HTCC, and the overall size is $36\times 14\times9.8$ mm³ and $54\times 14.5\times9.8$ mm³, respectively. Both the transmitters show good performance, and the measured output power is better than 8 and 5 dBm, respectively.

中文翻译：

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采用 HTCC 技术的 0.2 THz SiP 应用的高集成度和低成本发射机封装解决方案

采用高温共烧陶瓷 (HTCC) 技术，新推出了一种用于 0.2-THz 系统级封装 (SiP) 应用的高集成度和低成本发射器封装解决方案。为了改进 3-D 集成，探索和制造埋在 HTCC 封装中的内部垂直充气互连波导。设计了一个紧凑的 MoCu 波导带通滤波器 (BPF) 并将其集成到封装中，以抑制混频器的谐波输出。为了展示未来 0.2-THz 雷达系统中潜在的 SiP 应用，基于所提出的解决方案，设计、制造和测量了两个使用倍频器/混频器的 0.2-THz 发射器。所有组件都埋在HTCC中，整体尺寸为 $36\乘以 14\times9.8$毫米³和 $54\乘以 14.5\times9.8$毫米³，分别。两款发射机都表现出良好的性能，测得的输出功率分别优于 8 和 5 dBm。