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Variation of bending rigidity with material density: bilayer silica with nanoscale holes
Physical Chemistry Chemical Physics ( IF 3.3 ) Pub Date : 2022-06-06 , DOI: 10.1039/d2cp01960d
Martin Tømterud 1 , Sabrina D Eder 1 , Christin Büchner 2 , Markus Heyde 2 , Hans-Joachim Freund 2 , Joseph R Manson 3, 4 , Bodil Holst 1
Affiliation  

Two dimensional (2D) materials are a young class of materials that is foreseen to play an important role as building blocks in a range of applications, e.g. flexible electronics. For such applications, mechanical properties such as the bending rigidity κ are important. Only a few published measurements of the bending rigidity are available for 2D materials. Nearly unexplored is the question of how the 2D material density influences the bending rigidity. Here, we present helium atom scattering measurements on a “holey” bilayer silica with a density of 1.4 mg m−2, corresponding to 1.7 monolayers coverage. We find a bending rigidity of 6.6 ± 0.3 meV, which is lower than previously published measurements for a complete 2D film, where a value of 8.8 ± 0.5 meV was obtained. The decrease of bending rigidity with lower density is in agreement with theoretical predictions.

中文翻译:

弯曲刚度随材料密度的变化:具有纳米级孔的双层二氧化硅

二维 (2D) 材料是一类年轻的材料,预计将在一系列应用中发挥重要作用,例如柔性电子产品。对于此类应用,诸如弯曲刚度κ等机械性能很重要。只有少数已发表的弯曲刚度测量值可用于 2D 材料。二维材料密度如何影响弯曲刚度的问题几乎没有被探索过。在这里,我们展示了密度为 1.4 mg m -2的“多孔”双层二氧化硅上的氦原子散射测量结果,对应于 1.7 个单层覆盖率。我们发现弯曲刚度为 6.6 ± 0.3 meV,低于先前公布的完整 2D 薄膜测量值,其中获得的值为 8.8 ± 0.5 meV。较低密度下弯曲刚度的降低与理论预测一致。
更新日期:2022-06-10
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