Wearable electronics have continued to attract the attention of researchers and clinicians due to their great potential in medical applications. During their operations, the undesired heating may cause thermal discomfort or damage to skin. Seeking materials and structures for advanced thermal protection has become an urgent issue. Here, we report a soft, stretchable thermal protective substrate for wearable electronics with remarkable thermal insulating performance, mechanical compliance and stretchability. The thermal protective substrate features a composite design of the widely used polymeric material polydimethylsiloxane with embedded heat absorbing microspheres, consisting of phase change materials encapsulated inside the resin shell. Experimental and numerical studies show that the thermal protective substrate could be subjected to complex deformations over 150% and could reduce the peak skin temperature increase by 82% or higher under optimizations. In vivo demonstration of this concept on the mouse skin illustrates its unusual thermal protection capability for wearable thermal management.

可穿戴电子产品因其在医疗应用中的巨大潜力而​​继续吸引着研究人员和临床医生的关注。在他们的操作过程中，不希望的加热可能会导致热不适或对皮肤的伤害。寻求先进的热保护材料和结构已成为一个紧迫的问题。在这里，我们报告了一种用于可穿戴电子设备的柔软、可拉伸的热保护基板，具有出色的隔热性能、机械柔顺性和可拉伸性。热保护基板采用广泛使用的聚合材料聚二甲基硅氧烷与嵌入吸热微球的复合设计，由封装在树脂壳内的相变材料组成。实验和数值研究表明，热保护基板可以承受超过 150% 的复杂变形，并且在优化下可以将峰值皮肤温度升高降低 82% 或更高。这一概念在小鼠皮肤上的体内演示说明了其在可穿戴热管理方面的不同寻常的热保护能力。