Abstract. In recent decades, the rate of shrinking integrated-circuit components has slowed as challenges accumulate. Yet, in part by virtue of an accelerating rate of cleverness, the end-user value of new semiconductor processes steadily advances. On top of the miniaturization benefits delivered by optical lithography, value is boosted by innovations in wafer processing, mask synthesis, materials and devices, microarchitecture, and circuit design. Focusing on three decades of microprocessor data enables quantification of how innovations from those domains have contributed over time to integrated-circuit “value scaling” in terms of performance, power, and cost. At some point, lateral shrinking will end altogether and the kinds of ingenuity emerging from those domains may provide clues for how very large-scale integration value creation will advance beyond that point.

中文翻译：

---

回顾 VLSI 值缩放和光刻

摘要。近几十年来，随着挑战的积累，集成电路元件的缩小速度已经放缓。然而，部分由于智能速度的加快，新半导体工艺的最终用户价值稳步提升。除了光学光刻技术带来的小型化优势之外，晶圆加工、掩模合成、材料和设备、微架构和电路设计方面的创新也提升了价值。关注三个十年的微处理器数据，可以量化这些领域的创新如何随着时间的推移在性能、功耗和成本方面对集成电路“价值扩展”做出贡献。在某一点，