Film Capacitors with high-energy storage density, high-temperature stability and charge–discharge efficiency are highly desirable in advanced microelectronic and electrical power systems. Polymers have been widely adopted as the main dielectrics in film capacitors due to their low dielectric loss, high breakdown strength, flexibility, lightweight, low cost and ease of processing into a large area, defect-free and free-standing thin film. However, the low dielectric constant of dielectric polymers severely hinders the improvement in the energy storage density of dielectric polymer films. In the last two decades, numerous efforts have been made to improve the energy density of dielectric films through employing polymer nanodielectric composites (PNCs), all organic polymer composites (AOPCs), molecularly designed polymers (MDPs), multi-layered polymer composites (MPCs) and surface engineered polymers (SEPs). However, only surface engineered polymers stands out from other approaches in the improvement of energy density from a view of scalable, continuous and large-area treatment of thin polymer films, which is the most promising strategy to solve the urgent demand for high energy density in the film capacitor industry. Unlike prior reviews focusing on PNCs, AOPCs, MDPs and MPCs from a view of lab-scale production, this review focuses on recent achievements in surface engineering of two-dimensional (2D) dielectric polymer films on both lab and industry scale productions. The key factors that determine the energy storage performance of dielectric polymer films are discussed in detail. The conventional strategies to improve the energy storage performance of dielectric polymer films are briefly introduced. The challenges associated with scalable, continuous and large-area production of thin dielectric polymer films with high structural quality and uniform dielectric performance are then pointed out and emphasized. The categories of surface engineering strategy including radiation treatment, inorganic deposition and organic impregnation are subsequently introduced and the key factors and main principles for designing SEPs to improve the dielectric and energy storage performances of dielectric polymer films are discussed and summarized. Current attempts using SEPs to improve the energy storage performance of films are summarized in detail. Some key insights to the current progress on SEPs are subsequently stated. Future pathways for the improvements of dielectric and energy storage performances through surface engineering of 2D dielectric polymer films for both scientists and engineers are suggested.

具有高储能密度、高温稳定性和充放电效率的薄膜电容器在先进的微电子和电力系统中是非常需要的。聚合物因其介电损耗低、击穿强度高、柔韧性好、重量轻、成本低、易于加工成大面积、无缺陷和自支撑的薄膜而被广泛用作薄膜电容器的主要电介质。然而，介电聚合物的低介电常数严重阻碍了介电聚合物薄膜储能密度的提高。在过去的二十年中，通过采用聚合物纳米介电复合材料 (PNC)、全有机聚合物复合材料 (AOPC)、分子设计聚合物 (MDP)、多层聚合物复合材料（MPC）和表面工程聚合物（SEP）。然而，从可扩展、连续和大面积处理聚合物薄膜的角度来看，只有表面工程聚合物在提高能量密度方面从其他方法中脱颖而出，这是解决高能量密度迫切需求的最有希望的策略。薄膜电容器行业。与之前从实验室规模生产的角度关注 PNC、AOPC、MDP 和 MPC 的评论不同，本评论侧重于实验室和工业规模生产中二维 (2D) 介电聚合物薄膜表面工程的最新成就。详细讨论了决定介电聚合物薄膜储能性能的关键因素。简要介绍了提高介电聚合物薄膜储能性能的常规策略。然后指出并强调了与可扩展、连续和大面积生产具有高结构质量和均匀介电性能的薄介电聚合物薄膜相关的挑战。随后介绍了辐射处理、无机沉积和有机浸渍等表面工程策略的类别，并对设计SEPs以提高介电聚合物薄膜的介电和储能性能的关键因素和主要原则进行了讨论和总结。详细总结了当前使用 SEP 提高薄膜储能性能的尝试。随后陈述了对标准必要专利当前进展的一些关键见解。