Electrification is critical to decarbonizing society, but managing increasing power densification in electrical systems will require the development of new thermal management technologies. One approach is to use monolithic-metal-based heat spreaders that reduce thermal resistance and temperature fluctuation in electronic devices. However, their electrical conductivity makes them challenging to implement. Here we report co-designed electronic systems that monolithically integrate copper directly on electronic devices for heat spreading and temperature stabilization. The approach first coats the devices with an electrical insulating layer of poly(2-chloro-p-xylylene) (parylene C) and then a conformal coating of copper. This allows the copper to be in close proximity to the heat-generating elements, eliminating the need for thermal interface materials and providing improved cooling performance compared with existing technologies. We test the approach with gallium nitride power transistors, and show that it can be used in systems operating at up to 600 V and provides a low junction-to-ambient specific thermal resistance of 2.3 cm² K W^–1 in quiescent air and 0.7 cm² K W^–1 in quiescent water.

电气化对于社会脱碳至关重要，但管理电气系统中不断增加的功率密度需要开发新的热管理技术。一种方法是使用基于单片金属的散热器，以降低电子设备的热阻和温度波动。然而，它们的导电性使它们难以实施。在这里，我们报告了共同设计的电子系统，该系统将铜直接单片集成在电子设备上，以实现散热和温度稳定。该方法首先在设备上涂上一层聚（2-氯-p ）的电绝缘层。-二甲苯）（聚对二甲苯 C），然后是铜的保形涂层。与现有技术相比，这使得铜可以非常靠近发热元件，从而消除了对热界面材料的需求，并提供了更好的冷却性能。我们使用氮化镓功率晶体管对该方法进行了测试，结果表明它可以在高达 600 V 的系统中使用，并在静态空气中提供 2.3 cm ²  K W ^{–1和 0.7 cm 的低结到环境比热阻2}  K W ^–1在静止水中。