当前位置: X-MOL 学术Prog. Mater. Sci. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
3D printed electronics: Processes, materials and future trends
Progress in Materials Science ( IF 37.4 ) Pub Date : 2022-03-16 , DOI: 10.1016/j.pmatsci.2022.100945
Hong Wei Tan , Yu Ying Clarrisa Choong , Che Nan Kuo , Hong Yee Low , Chee Kai Chua

In recent years, the industries and researchers have demonstrated a strong interest in 3D (3-dimensional) printed electronics due to their tremendous potentials to deliver unique features not attainable by traditional manufacturing methods. This latest technology is potentially revolutionary, and the upcoming research trend is inclining towards 3D embedded electrical devices, 3D conformal electronics, flexible 3D printed electronics and stretchable 3D printed electronics applications. A deep understanding of the advanced functional materials for the fabrication of 3D printing electronic devices is also important since there are so many different types of inks that exist. This review offers an in-depth overview for the latest 3D electronic printing techniques and developments in innovative practical technologies used to fabricate 3D printed electronics devices. The latest progress in the advanced functional materials used for fabricating 3D printed electronics devices and the upcoming application trends is thoroughly discussed too.



中文翻译:

3D 打印电子产品:工艺、材料和未来趋势

近年来,行业和研究人员对 3D(3 维)印刷电子产品表现出浓厚的兴趣,因为它们具有提供传统制造方法无法实现的独特功能的巨大潜力。这项最新技术具有潜在的革命性意义,而即将到来的研究趋势则倾向于 3D 嵌入式电气设备、3D 保形电子设备、柔性 3D 打印电子设备和可拉伸 3D 打印电子设备应用。深入了解用于制造 3D 打印电子设备的先进功能材料也很重要,因为存在许多不同类型的墨水。本综述深入概述了最新的 3D 电子打印技术以及用于制造 3D 打印电子设备的创新实用技术的发展。还深入讨论了用于制造 3D 打印电子设备的先进功能材料的最新进展以及即将到来的应用趋势。

更新日期:2022-03-16
down
wechat
bug