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Silver particle interlayer with high dislocation density for improving the joining of BaZr0.1Ce0.7Y0.1Yb0.1O3-δ electrolyte and AISI 441 interconnect
Journal of Materiomics ( IF 9.4 ) Pub Date : 2022-03-05 , DOI: 10.1016/j.jmat.2022.02.014
Xiaoyang Wang 1 , Chun Li 1 , Qihan Zhou 1 , Mingshen Li 1 , Mushi Zheng 1 , Junlei Qi 1 , Xiaoqing Si 1 , Jian Cao 1
Affiliation  

One of the critical challenges for the protonic ceramic fuel cell stack is sealing electrolytes and interconnects. However, the traditional Agsingle bondCuO sealant will aggravate the oxidation along the interconnect surface and result in brittle compound layers at the BaZr0.1Ce0.7Y0.1Yb0.1O3-δ (BZCYYb) electrolyte interface. The present work demonstrates that a silver particle interlayer with high dislocation density can be adopted to join BZCYYb electrolyte to the interconnect (AISI 441 stainless) in air instead of traditional Agsingle bondCuO sealant. Elevating temperatures result in a sufficient bonding at the Ag/BZCYYb interface, and a defect-free joint is obtained at 950 °C. Atomic bonding at Ag/BZCYYb interface is confirmed by TEM. Also, a dense and thin oxide layer (2–3 μm) is formed along the AISI 441 interface. Ag particles in the interlayer provide the main driving force for the sintering joining. The massive dislocations promote the recovery and recrystallization of the Ag interlayer, as well as the interdiffusion of BZCYYb/Ag. After aging in the wet oxidizing atmosphere at 600 °C for 300 h, joints remain intact and dense, indicating superior oxidation resistance and aging performance. Besides, the joint shear strength (25.3 MPa) is 59 % higher than that of the joint brazed by traditional Agsingle bondCuO.



中文翻译:

用于改善 BaZr0.1Ce0.7Y0.1Yb0.1O3-δ 电解液与 AISI 441 互连连接的高位错密度银颗粒中间层

质子陶瓷燃料电池堆的关键挑战之一是密封电解质和互连。然而,传统的 Ag 单键CuO 密封剂会加剧沿互连表面的氧化,并导致 BaZr 0.1 Ce 0.7 Y 0.1 Yb 0.1 O 3- δ (BZCYYb) 电解质界面处的化合物层变脆。目前的工作表明,可以采用具有高位错密度的银颗粒中间层将 BZCYYb 电解质连接到空气中的互连(AISI 441 不锈钢),而不是传统的 Ag单键氧化铜密封剂。升高温度导致在 Ag/BZCYYb 界面处充分结合,并且在 950 °C 时获得无缺陷接头。TEM 证实了 Ag/BZCYYb 界面处的原子键合。此外,沿 AISI 441 界面形成致密而薄的氧化层(2-3 μm)。中间层中的Ag颗粒为烧结接合提供了主要驱动力。大量位错促进了Ag中间层的恢复和再结晶,以及BZCYYb/Ag的相互扩散。在 600 ℃的湿氧化气氛中老化 300 h 后,接头保持完整和致密,表明具有优异的抗氧化性和老化性能。此外,接头剪切强度(25.3 MPa)比传统 Ag 单键CuO 钎焊接头高 59%。

更新日期:2022-03-05
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