当前位置: X-MOL 学术J. Mater. Process. Tech. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Diffusion bonding and interface structure of advanced carbide-dispersion-strengthened Cu and oxide-dispersion-strengthened W
Journal of Materials Processing Technology ( IF 6.3 ) Pub Date : 2022-01-19 , DOI: 10.1016/j.jmatprotec.2022.117508
Lu Han 1 , Jing Wang 1 , Yuanyuan Chen 1 , Zhang Liu 1 , Yuan Huang 1 , Dongguang Liu 2 , Laima Luo 2 , Chenxi Liu 1 , Yongchang Liu 1 , Zumin Wang 1
Affiliation  

Metallurgical bonding was achieved between carbide-dispersion-strengthened Cu (CDS-Cu) and oxide-dispersion-strengthened W (ODS-W) after diffusion bonding via an interface tailoring method of anodization and deoxidation of ODS-W combined with the introduction of Cu wetting layer. The shear strength of the CDS-Cu/ODS-W joints fabricated by the interface-tailoring bonding is 124 MPa, which is higher than that of 99 MPa of the joint prepared by direct bonding. The increase in strength is due to the achievement of the metallurgical bonding between CDS-Cu/ODS-W, the increase of the debonding energy and the increase of propagation distance of the cracks. After metallurgical bonding, the second phase particles of WC in CDS-Cu and Y2O3 in ODS-W were dispersed at the phase boundary to reduce the lattice strain energy. This work paves the way for the preparation of advanced plasma-facing components comprised of high-performance CDS-Cu and ODS-W for China Fusion Engineering Test Reactor (CFETR).

更新日期:2022-01-24
down
wechat
bug