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An on-chip test structure to measure the Seebeck coefficient of thermopile sensors
Journal of Micromechanics and Microengineering ( IF 2.3 ) Pub Date : 2021-12-02 , DOI: 10.1088/1361-6439/ac3be1
Peng Huang 1, 2 , Jianyu Fu 1, 2, 3 , Yihong Lu 4 , Jinbiao Liu 4 , Jian Zhang 3 , Dapeng Chen 1, 2, 3
Affiliation  

Thermopile sensors have a wide range of applications in consumer and industry. Seebeck coefficient is a basic thermal parameter of thermopile sensors. Extracting the Seebeck coefficient of both materials and thermocouple in thermopile sensors is of great importance. In this work, an on-chip test structure is designed. It consists of a substrate, a framework, supporting legs and a sensitive region which has a resistor serving as both heater and temperature detector. A set of on-chip test structures are fabricated along with a thermopile sensor. Its measurement results are analyzed and compared with apparatus measurement results. These results are consistent with each other, and the validity of structure is verified.

中文翻译:

用于测量热电堆传感器塞贝克系数的片上测试结构

热电堆传感器在消费者和工业领域有着广泛的应用。塞贝克系数是热电堆传感器的基本热参数。提取热电堆传感器中材料和热电偶的塞贝克系数非常重要。在这项工作中,设计了一种片上测试结构。它由一个基板、一个框架、支撑腿和一个敏感区域组成,敏感区域有一个电阻作为加热器和温度检测器。一组片上测试结构与热电堆传感器一起制造。对其测量结果进行分析并与仪器测量结果进行比较。这些结果相互吻合,验证了结构的有效性。
更新日期:2021-12-02
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