Organic semiconducting polymers have opened a new paradigm for soft electronics due to their intrinsic flexibility and solution processibility. However, the contradiction between the mechanical stretchability and electronic performances restricts the implementation of high-mobility polymers with rigid molecular backbone in deformable devices. Here, we report the realization of high mobility and stretchability on curvilinear polymer microstructures fabricated by capillary-gradient assembly method. Curvilinear polymer microstructure arrays are fabricated with highly ordered molecular packing, controllable pattern, and wafer-scale homogeneity, leading to hole mobilities of 4.3 and 2.6 cm² V⁻¹ s⁻¹ under zero and 100% strain, respectively. Fully stretchable field-effect transistors and logic circuits can be integrated in solution process. Long-range homogeneity is demonstrated with the narrow distribution of height, width, mobility, on-off ratio and threshold voltage across a four-inch wafer. This solution-assembly method provides a platform for wafer-scale and reproducible integration of high-performance soft electronic devices and circuits based on organic semiconductors.

有机半导体聚合物由于其固有的灵活性和溶液可加工性，为软电子开辟了新的范式。然而，机械拉伸性和电子性能之间的矛盾限制了具有刚性分子骨架的高迁移率聚合物在可变形器件中的实施。在这里，我们报告了通过毛细管梯度组装方法制造的曲线聚合物微结构的高流动性和拉伸性的实现。曲线聚合物微结构阵列采用高度有序的分子堆积、可控图案和晶圆级均匀性制造，导致空穴迁移率为 4.3 和 2.6 cm ² V ^-1 s ^-1分别在零和 100% 应变下。完全可拉伸的场效应晶体管和逻辑电路可以集成在解决方案过程中。四英寸晶圆上的高度、宽度、迁移率、开关比和阈值电压分布较窄，这证明了长期均匀性。这种溶液组装方法为基于有机半导体的高性能软电子器件和电路的晶圆级和可重复集成提供了一个平台。