The discovery of the ‘magic angle’ in twisted bilayer graphene (tBLG) triggered tremendous interests in the studies of twist-stacked 2D materials and symbolized the onset of ‘twistronics’. The unprecedented properties exhibited by twist-stacked 2D materials are enabled by simply stacking 2D materials with a twist angle. However, it is by no means trivial to establish such material systems in high quality and efficiency. The assembly technologies enabling the construction of twist-stacked 2D materials are critical to achieve the desired properties. Here, we review the state-of-the-art mainstream assembly technologies to produce twist-stacked 2D materials, by using tBLG as a representative materaisl system. We analyzed the advantages and disadvantages of bottom-up and top-down assembly techniques, discussed the assemblies of twist-stacked 2D materials beyond graphene, and proposed potential areas for future investigations to advance the technology to the next level.

扭曲双层石墨烯（tBLG）中“魔角”的发现引发了人们对扭曲堆叠二维材料研究的极大兴趣，并象征着“扭曲电子学”的开始。通过简单地堆叠具有扭曲角的 2D 材料，可以实现扭曲堆叠 2D 材料展示的前所未有的特性。然而，高质量、高效率地建立这样的材料体系绝非易事。能够构建扭曲堆叠 2D 材料的组装技术对于实现所需的性能至关重要。在这里，我们回顾了通过使用 tBLG 作为代表性材料系统来生产扭曲堆叠 2D 材料的最先进的主流组装技术。我们分析了自底向上和自顶向下组装技术的优缺点，