The electronic packaging and systems are very important topics as the limitation of miniaturization approaches in semiconductor industry. Regarding the optimal materials microstructure for these applications, we studied different alloys such as Sn-3.0Ag-0.5Cu (wt.%)/organic solderability preservative (SAC305/OSP) Cu and SAC305–0.05Ni/OSP Cu solder joints. We implemented the fractal dimension characterization and microstructure morphology reconstruction. This is the first time that we applied fractals on such alloys. The morphology reconstruction is important for predicting and designing the optimal microstructure for the advanced desirable properties these alloys. These analyzed parameters are important for the hand-held devices and systems especially for the exploitation. The fractal reconstruction was applied on the prepared microstructures with five different magnifications. The results confirmed successful application of fractals in this area of materials science considering the grains and shapes reconstructions.

中文翻译：

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应用 SAC305/OSP Cu 和 SAC305-0.05Ni/OSP Cu 焊点晶粒形成的分形性质分析用于微电子封装

作为半导体工业中小型化方法的限制，电子封装和系统是非常重要的课题。关于这些应用的最佳材料微观结构，我们研究了不同的合金，例如 Sn-3.0Ag-0.5Cu (wt.%)/有机可焊性防腐剂 (SAC305/OSP) Cu 和 SAC305–0.05Ni/OSP Cu 焊点。我们实施了分形维数表征和微观结构形态重建。这是我们第一次在此类合金上应用分形。形态重建对于预测和设计这些合金的先进理想性能的最佳微观结构非常重要。这些分析的参数对于手持设备和系统非常重要，特别是对于开发而言。分形重建以五种不同的放大倍数应用于制备的微结构。考虑到晶粒和形状的重建，结果证实了分形在材料科学领域的成功应用。