With significant recent advancements in thermal sciences—such as the development of new theoretical and experimental techniques, and the discovery of new transport mechanisms—it is helpful to revisit the fundamentals of vibrational heat conduction to formulate an updated and informed physical understanding. The increasing maturity of simulation and modeling methods sparks the desire to leverage these techniques to rapidly improve and develop technology through digital engineering and multi-scale, electro-thermal models. With that vision in mind, this review attempts to build a holistic understanding of thermal transport by focusing on the often unaddressed relationships between subfields, which can be critical for multi-scale modeling approaches. For example, we outline the relationship between mode-specific (computational) and spectral (analytical) models. We relate thermal boundary resistance models based on perturbation approaches and classic transmissivity based models. We discuss the relationship between lattice dynamics and molecular dynamics approaches along with two-channel transport frameworks that have emerged recently and that connect crystal-like and amorphous-like heat conduction. Throughout, we discuss best practices for modeling experimental data and outline how these models can guide material-level and system-level design.

中文翻译：

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有缺陷和无序材料中的热传输

随着热科学的重大进展——例如新理论和实验技术的发展，以及新传输机制的发现——重新审视振动热传导的基本原理以形成更新和知情的物理理解是有帮助的。仿真和建模方法的日益成熟激发了利用这些技术通过数字工程和多尺度电热模型快速改进和开发技术的愿望。考虑到这一愿景，本综述试图通过关注子域之间经常未解决的关系来建立对热传输的整体理解，这对于多尺度建模方法至关重要。例如，我们概述了特定模式（计算）和频谱（分析）模型之间的关系。我们将基于扰动方法的热边界电阻模型和基于经典透射率的模型联系起来。我们讨论了晶格动力学和分子动力学方法之间的关系，以及最近出现的连接类晶体和非晶态热传导的双通道传输框架。在整个过程中，我们讨论了模拟实验数据的最佳实践，并概述了这些模型如何指导材料级和系统级设计。我们讨论了晶格动力学和分子动力学方法之间的关系，以及最近出现的连接类晶体和非晶态热传导的双通道传输框架。在整个过程中，我们讨论了模拟实验数据的最佳实践，并概述了这些模型如何指导材料级和系统级设计。我们讨论了晶格动力学和分子动力学方法之间的关系，以及最近出现的连接类晶体和非晶态热传导的双通道传输框架。在整个过程中，我们讨论了模拟实验数据的最佳实践，并概述了这些模型如何指导材料级和系统级设计。