Polymer-based conductive nanocomposites are promising for electromagnetic interference (EMI) shielding to ensure stable operations of electronic devices and protect humans from electromagnetic radiation. Although MXenes have shown high EMI shielding performances, it remains a great challenge to construct highly efficient EMI shielding polymer/MXene composite films with minimal MXene content and high durability to harsh conditions. Here, hierarchically porous polyimide (PI)/Ti₃C₂T_x films with consecutively conductive pathways have been constructed via a unidirectional PI aerogel–assisted immersion and hot-pressing strategy. Contributed by special architectures and high conductivities, PI/Ti₃C₂T_x films with 2.0 volume % Ti₃C₂T_x have high absolute EMI shielding effectiveness up to 15,527 dB cm² g⁻¹ at the thickness of 90 μm. Superior EMI shielding performance can be retained even after being subjected to hygrothermal or combustion environments, cryogenic (−196°C) or high (250°C) temperatures, and rapid thermal shock (∆T = 446°C), demonstrating high potential as high-performance EMI shielding materials resisting harsh conditions.

中文翻译：

---

多层多孔聚酰亚胺/Ti3C2Tx 薄膜在耐受恶劣条件后具有稳定的电磁干扰屏蔽

基于聚合物的导电纳米复合材料有望用于电磁干扰 (EMI) 屏蔽，以确保电子设备的稳定运行并保护人类免受电磁辐射。尽管 MXenes 已显示出较高的 EMI 屏蔽性能，但构建高效的 EMI 屏蔽聚合物/MXene 复合薄膜仍然是一个巨大的挑战，该薄膜具有最少的 MXene 含量和对恶劣条件的高耐久性。在这里，通过单向 PI 气凝胶辅助浸渍和热压策略构建了具有连续导电通路的分级多孔聚酰亚胺 (PI)/Ti ₃ C ₂ T _x薄膜。由特殊结构和高电导率贡献，PI/Ti ₃ C ₂ T _x具有 2.0 体积 % Ti ₃ C ₂ T _x的薄膜在 90 μm 的厚度下具有高达 15,527 dB cm ² g ^{-1的高绝对 EMI 屏蔽效率。}即使在经受湿热或燃烧环境、低温 (-196°C) 或高温 (250°C) 以及快速热冲击 (Δ T = 446°C) 后，仍可保持出色的 EMI 屏蔽性能，展示出高潜力作为抗恶劣条件的高性能 EMI 屏蔽材料。