New Cu–Mo composite materials were produced by physical vapor deposition (PVD) using an L5 electron-beam unit. They were proposed as an alternative to silver-containing materials for the manufacture of electrical contacts. The electrical (resistivity), mechanical (hardness, shear strength), and chemical (oxidation resistance in long-term operation at high currents and temperatures, welding resistance of contact systems at peak loads) properties of the PVD Cu–Mo composites were studied against the properties of serial electrical contact materials manufactured from AgC5 and Ag–CdO pseudoalloys. The developed materials were found to be competitive with silver-based composites in terms of output resistivity and welding resistance of contact systems at currents up to 3000 A, exceeding the rated values by more than 10 times. The resistivity increased by two to three times, but no signs of seizure (welding) were found on any contact. The brazed joint with a contact copper support for the Cu–Mo alloys showed more than two times greater strength and four times greater hardness than that for the AgC5 alloys. At the same time, the developed copper-based alloys were inferior to the silver-based alloys in oxidation resistance, in turn leading to greater resistivity and heating of the contacts. The corrosion resistance of the Cu–Mo alloys strongly depends on the presence of droplet inclusions (with corrosion processes being intensified around them), operating environment, and operating temperature of the contacts. In operating conditions with minimal oxidation processes (low humidity, room temperature), the use of copper-based contacts is much more expedient because they are less costly compared to silver-based contacts.

使用 L5 电子束单元通过物理气相沉积 (PVD) 生产新的 Cu-Mo 复合材料。它们被提议作为用于制造电触点的含银材料的替代品。PVD Cu-Mo 复合材料的电气（电阻率）、机械（硬度、剪切强度）和化学（在高电流和温度下长期运行时的抗氧化性、接触系统在峰值负载下的耐焊接性）性能进行了研究。由 AgC5 和 Ag-CdO 假合金制成的系列电接触材料的性能。发现开发的材料在电流高达 3000 A 时触点系统的输出电阻率和焊接电阻方面与银基复合材料具有竞争力，超过额定值 10 倍以上。电阻率增加了两到三倍，但在任何接触上都没有发现卡住（焊接）的迹象。与 AgC5 合金相比，Cu-Mo 合金具有接触铜支撑的钎焊接头强度高出两倍以上，硬度高出四倍。同时，开发的铜基合金在抗氧化性方面不如银基合金，从而导致更大的电阻率和触点发热。Cu-Mo 合金的耐腐蚀性在很大程度上取决于液滴夹杂物的存在（其周围的腐蚀过程正在加剧）、工作环境和触点的工作温度。在氧化过程最少的操作条件下（低湿度、室温），