In recent years, shape memory smart materials have developed rapidly, and more and more novel shape memory polymers have been developed and applied. In sharp contrast to the rapid development of shape memory smart materials, its theoretical research is obviously lagging behind. Therefore, it is necessary to clearly understand and master the thermodynamic dynamic response mechanism of shape memory polymers. In view of the fact that the influence of thermodynamic properties of hybrid shape memory polymer under the coupling effect of multiple factors is still very vague, a novel hybrid shape memory polymer composites (SMPC) thermodynamic viscoelastic constitutive model is proposed for the first time by combining the macroscopic phenomenological viscoelastic theory with the microscopic phenomenological phase transition model, and a microstructure composed of two parts of reversible phase and stationary phase in parallel is constructed. At the same time, a three-dimensional parameter equation with temperature effect and capable of describing the coordinated changes of various parameters in the phase transition process is established. Through the validation of the model, it can be found that the variation trend of the simulation curve is in good agreement with the experimental curve during the whole static loading process, and the error of the fracture stress is less than 2%. Through the dynamic evolution of multi-content and wide-temperature range, the consistency between the simulation results and the experimental results is successfully proved, and the microscopic mechanism of the macroscopic static mechanical behavior of the hybrid SMPC is revealed. The model established in this paper can accurately describe the internal phase change of the mixed matrix, and realize the effective prediction of the stress-strain response under the coupling effect of the matrix composition and the external environment. The proposal of this model provides a new idea for the exploration of hybrid SMPC thermodynamic viscoelastic theory, and also provides an important theoretical reference for the development and application of novel hybrid shape memory materials in the future.

近年来，形状记忆智能材料发展迅速，越来越多的新型形状记忆聚合物被开发和应用。与形状记忆智能材料的飞速发展形成鲜明对比的是，其理论研究明显滞后。因此，有必要清楚地了解和掌握形状记忆聚合物的热力学响应机制。针对多因素耦合作用下杂化形状记忆聚合物热力学性能的影响还很模糊的事实，首次提出了一种新型的杂化形状记忆聚合物复合材料（SMPC）热力学粘弹性本构模型。宏观唯象粘弹性理论与微观唯象相变模型，并构建了由可逆相和固定相两部分平行组成的微观结构。同时，建立了具有温度效应、能够描述相变过程中各参数协调变化的三维参数方程。通过模型验证可以发现，在整个静载过程中，模拟曲线的变化趋势与实验曲线吻合较好，断裂应力误差小于2%。通过多内容、宽温度范围的动态演化，成功证明了模拟结果与实验结果的一致性，揭示了混合SMPC宏观静态力学行为的微观机制。本文建立的模型可以准确地描述混合基体的内部相变，实现基体成分与外部环境耦合作用下应力应变响应的有效预测。该模型的提出为混合SMPC热力学粘弹性理论的探索提供了新思路，也为今后新型混合形状记忆材料的开发和应用提供了重要的理论参考。