Improving the heat dissipation efficiency of electronic products is the key to the design of many modern electronic and mechanical systems. Herein, we combined the 3D network fabricating with the way of micron-nano reinforcement to prepare high thermal conductivity and excellent thermal stability composites. Epoxy resin was used as the matrix, while the silicon carbide foam (f-SiC) as skeleton and the BN/nano-SiC as thermally conductive fillers. The thermal conductivity of the EP/f-SiC/BN/nano-SiC composite reaches 3.5 W·m^− 1·K^− 1, which is about 16.6 times higher than that of pure epoxy resin. The characterization results of TC and infrared thermography images indicate that the EP/f-SiC/BN/nano-SiC composite possess superior heat transport performance. Meantime, the EP/f-SiC/BN/nano-SiC composite have excellent thermal stability, the T_HRI of EP/f-SiC/BN/nano-SiC reaches 195.8℃, which is 21.3℃ higher than that of pure EP. This work would provide a new strategy for improving the TC of polymers by using other 3D skeletons and micron-nano fillers, and is conducive to the development of high thermal conductivity and excellent thermal stability materials.

提高电子产品的散热效率是许多现代电子和机械系统设计的关键。在此，我们将 3D 网络制造与微米纳米增强的方式相结合，制备出高导热性和优异热稳定性的复合材料。以环氧树脂为基体，碳化硅泡沫（f-SiC）为骨架，BN/纳米碳化硅为导热填料。EP/f-SiC/BN/纳米-SiC复合材料的热导率达到3.5 W·m ^{− 1} ·K ^{− 1}，比纯环氧树脂高约16.6倍。TC 和红外热成像图像的表征结果表明 EP/f-SiC/BN/纳米 SiC 复合材料具有优异的传热性能。同时，EP/f-SiC/BN/nano-SiC复合材料具有优异的热稳定性，EP/f-SiC/BN/nano-SiC的T _HRI达到195.8℃，比纯EP高21.3℃。该工作将为利用其他3D骨架和微米纳米填料提高聚合物的TC提供新的策略，有利于开发高导热性和优异的热稳定性材料。