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The MEMS-Based Electrochemical Seismic Sensor With Integrated Sensitive Electrodes by Adopting Anodic Bonding Technology
IEEE Sensors Journal ( IF 4.3 ) Pub Date : 2021-07-12 , DOI: 10.1109/jsen.2021.3096496
Chao Xu , Junbo Wang , Deyong Chen , Jian Chen , Bowen Liu , Wenjie Qi , Tian Liang , Xu She

Seismic sensors are the key sensitive components in geophysical exploration, and the new-type electrochemical seismic sensors have gradually aroused researchers’ interest for their superior performance in low-frequency domain and large working inclination. In this paper, a method was developed to fabricate the MEMS (micro-electro-mechanical systems) based integrated electrodes for the electrochemical seismic sensors. The proposed integrated electrodes which employed three-layer anodic bonding structure of silicon-glass-silicon served as the substitutes for multilayer manual assembly structures. Compared to previous counterparts, this integrated structure has the advantages of simplified assembly processes of sensitive unit and high consistency as the no requirement of manual alignment. The results shown that the cross-correlation coefficient between two proposed devices was quantified as 0.998 with the sensitivity of 5956 V/(m/s) @1Hz. This electrode is so far the sensitive structure which realize both high sensitivity and high integration in the electrochemical seismic sensors.

中文翻译:

采用阳极键合技术的集成敏感电极的基于MEMS的电化学地震传感器

地震传感器是地球物理勘探中的关键敏感元件,新型电化学地震传感器以其在低频域和大工作倾角方面的优越性能逐渐引起了研究人员的兴趣。在本文中,开发了一种方法来制造基于 MEMS(微机电系统)的电化学地震传感器集成电极。所提出的集成电极采用硅-玻璃-硅的三层阳极键合结构,可替代多层手工组装结构。与以往的同类产品相比,这种一体化结构具有简化敏感单元组装过程和高一致性的优点,无需手动对准。结果表明,两个提出的设备之间的互相关系数量化为 0.998,灵敏度为 5956 V/(m/s) @1Hz。该电极是迄今为止电化学地震传感器中实现高灵敏度和高集成度的灵敏结构。
更新日期:2021-09-17
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