The paper discusses an approach to the design of the forced air-cooling heat sink for power electronic application to uniformly distribute the temperature of the semiconductor modules fixed on the top of the heat sink. The proposed approach suggests a minor modification of a conventional fin-based heat sink commonly manufactured for cooling of power electronic modules. Following the proposed modification, an air guide plate having a V-shaped cut is attached to the bottom of the heat sink to redistribute the airflow through the fins. To verify the proposed approach, the modified forced air-cooling system for a power electronic circuit comprising of three IGBT modules was modelled and numerically simulated using Ansys Fluent software under steady-state conditions. The numerical analysis was conducted for a range of power loss 50–100 W in each IGBT module and an airspeed of 5 m/s through the heat sink. The simulation results have shown a good uniform distribution of the temperature across the IGBT modules where the temperature difference does not exceed 0.21 °C.

本文讨论了一种用于电力电子应用的强制风冷散热器的设计方法，以均匀分布固定在散热器顶部的半导体模块的温度。所提出的方法建议对通常为冷却电力电子模块而制造的传统鳍式散热器进行微小修改。根据提议的修改，具有 V 形切口的空气引导板连接到散热器的底部，以重新分配通过散热片的气流。为了验证所提出的方法，在稳态条件下使用 Ansys Fluent 软件对包含三个 IGBT 模块的电力电子电路的改进型强制风冷系统进行建模和数值模拟。数值分析是针对每个 IGBT 模块中 50-100 W 的功率损耗范围和 5 m/s 通过散热器的空速进行的。仿真结果表明 IGBT 模块的温度分布良好，温差不超过 0.21 °C。