In the application of electronic products, it is critical for conductive adhesives to ensure high electrical conductivity and good adhesion reliability. In this study, isotropic conductive adhesives (ICAs) with high conductivity and low percolation threshold can be achieved by making full use of the synergistic effect of micron spherical and flaky silver-coated copper (Cu@Ag) conductive fillers. The flaky Cu@Ag powder prepared by electroless plating was chosen as the main conductive filler, and the spherical core-shell structure Cu@Ag powder was used as an auxiliary conductive filler to be dispersed in the flaky Cu@Ag particles, providing more possibilities for building a large number of conductive bridges. In this study, the Cu@Ag powder was synthesized to eliminate the disadvantages of Cu oxidation and Ag electrochemical migration, while making the ICAs low cost and favourable conductivity. Furthermore, the curing parameters were optimized for the matrix resin in corresponding experiments. The results showed that a combination of spherical and flaky Cu@Ag powders in ICAs could not only significantly reduce the percolation threshold and the bulk resistivity but also increase the shear strength compared with the single component. In particular, the bulk resistivity of the optimum sample was 1.95 × 10⁻³ Ω cm, and the shear strength was 22.69 MPa when the filler content was only 60 wt%. Hence, the ICAs filled with spherical and flaky Cu@Ag will pave the way for high-performance and low-cost ICAs in the electronics packaging industry.

在电子产品的应用中，对于导电胶来说，保证高导电性和良好的粘合可靠性是至关重要的。本研究充分利用微米球形和片状银包铜（Cu@Ag）导电填料的协同作用，实现了具有高导电性和低渗流阈值的各向同性导电胶（ICAs）。选择化学镀制备的片状Cu@Ag粉末作为主要导电填料，球状核壳结构Cu@Ag粉末作为辅助导电填料分散在片状Cu@Ag颗粒中，提供了更多可能用于建造大量的导电桥。本研究合成了Cu@Ag粉末，以消除Cu氧化和Ag电化学迁移的缺点，同时使ICA成本低且导电性良好。此外，在相应的实验中对基体树脂的固化参数进行了优化。结果表明，与单一组分相比，ICAs中球形和片状Cu@Ag粉末的组合不仅可以显着降低渗流阈值和体积电阻率，而且可以提高剪切强度。特别是，最佳样品的体电阻率为 1.95 × 10 结果表明，与单一组分相比，ICAs中球形和片状Cu@Ag粉末的组合不仅可以显着降低渗流阈值和体积电阻率，而且可以提高剪切强度。特别是，最佳样品的体电阻率为 1.95 × 10 结果表明，与单一组分相比，ICAs中球形和片状Cu@Ag粉末的组合不仅可以显着降低渗流阈值和体积电阻率，而且可以提高剪切强度。特别是，最佳样品的体电阻率为 1.95 × 10^-3 Ω cm，当填料含量仅为60 wt%时，剪切强度为22.69 MPa。因此，填充球形和片状 Cu@Ag 的 ICA 将为电子封装行业的高性能和低成本 ICA 铺平道路。