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Thermodynamically revealing the effect mechanism of Cu on the interfacial metallurgical reaction for Al/steel welding-brazing joint
Journal of Materials Processing Technology ( IF 6.3 ) Pub Date : 2021-09-14 , DOI: 10.1016/j.jmatprotec.2021.117372
Tao Yang 1 , Wei Dai 1 , Long Chen 1 , Yuan Zhuang 1 , Zengming Zhou 1 , Juncheng Hu 1
Affiliation  

Developing excellent mechanical properties of Al/steel welding-brazing joint adding alloy elements for vehicle structure lightweight is in immediate need to reveal the effect mechanism of alloy elements on the interfacial metallurgical reaction. Here, the Al/steel welding-brazing joints with different Cu-coating thicknesses were designed to determine the effect rule of Cu on mechanical properties and interfacial microstructure evolution. More importantly, the action mechanism of Cu element on diffusion behavior of interfacial elements was clarified by synchrotron radiation light source and thermodynamic models. The results showed that appropriate Cu could improve the tensile strength of joints. And the Cu could efficiently inhibit the growth of interfacial brittle intermetallic compounds (IMCs) and the Fe diffusion into molten pool. Because the chemical potential of Fe in the molten pool increased with an increasing Cu content, which weakened the driving force of Fe diffusion. Besides, Cu and Al would react with each other to form Al2Cu with a lower Gibbs free energy under higher Cu content, which deteriorated the tensile strength of joints. Unambiguously, this work will deepen the understanding of the effect mechanism of Cu on the interfacial metallurgical reaction, which will be beneficial to the development and application of excellent properties of Al/Cu-coating/steel welding joints.



中文翻译:

热力学揭示Cu对铝/钢焊接-钎焊接头界面冶金反应的影响机制

开发具有优异力学性能的铝/钢焊-钎接头,添加合金元素用于汽车结构轻量化,迫切需要揭示合金元素对界面冶金反应的影响机制。在这里,设计了具有不同铜涂层厚度的铝/钢焊接-钎焊接头,以确定铜对力学性能和界面微观结构演变的影响规律。更重要的是,通过同步辐射光源和热力学模型阐明了Cu元素对界面元素扩散行为的作用机制。结果表明,适量的Cu能提高接头的抗拉强度。并且Cu可以有效地抑制界面脆性金属间化合物(IMCs)的生长和Fe扩散到熔池中。因为熔池中Fe的化学势随着Cu含量的增加而增加,削弱了Fe扩散的驱动力。此外,Cu和Al会相互反应形成Al2 Cu在较高的Cu含量下具有较低的吉布斯自由能,从而降低了接头的抗拉强度。毫无疑问,这项工作将加深对Cu对界面冶金反应的影响机制的理解,这将有利于Al/Cu涂层/钢焊接接头的优异性能的开发和应用。

更新日期:2021-09-16
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