Present paper reports the thermal performance of phase change material (PCM) based heat sinks (HSs) with foams (metallic and non-metallic) and HS with fins and without fins. The effect of volume fraction of thermal conductivity enhancer (TCE), volume fraction of PCM, and input heat flux values ($q^{″}$ = 1.5–2.5 kW/m²) on the performance of PCM-based HS are studied through experimental investigation. At $q^{″}$ = 1.5 kW/m², the enhancement ratio in operating time for PCM-based HS with carbon foam (CF) and PCM-based HSNF is found to be 5.5 and 2.73 times higher compared to HS with no PCM. For PCM-based HS with CF, the reduction in base temperature is found to be 17.47% with 5% TCE compared to 25% TCE. During discharging process, HSSPF exhibits 13.7% less time to reach SPT of 35 °C in comparison to HSNF filled with PCM. A multi attribute decision-making optimization technique (VIKOR method) is employed to find the best HS configuration, and it is found that the PCM-based HS with CF can be utilized for the effective cooling of electronic components.

本论文报告了基于相变材料 (PCM) 的具有泡沫（金属和非金属）的散热器 (HS) 和带翅片和不带翅片的 HS 的热性能。导热增强剂 (TCE) 的体积分数、PCM 的体积分数和输入热通量值的影响 ($q^{”}$ = 1.5–2.5 kW/m ² ) 对基于 PCM 的 HS 的性能进行了实验研究。在$q^{”}$ = 1.5 kW/m ²，与没有 PCM 的 HS 相比，具有碳泡沫 (CF) 的基于 PCM 的 HS 和基于 PCM 的 HSNF 的操作时间增强比高 5.5 和 2.73 倍。对于具有 CF 的基于 PCM 的 HS，发现与 25% TCE 相比，使用 5% TCE 时基础温度降低了 17.47%。在放电过程中，与填充有 PCM 的 HSNF 相比，HSSPF 达到 35°C SPT 的时间减少了 13.7%。采用多属性决策优化技术（VIKOR 方法）寻找最佳 HS 配置，发现具有 CF 的基于 PCM 的 HS 可用于电子元件的有效冷却。