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Foreword Special Section on “Advances in Electrical Modeling and Validation of Electronic Packaging and Systems”
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2021-09-13 , DOI: 10.1109/tcpmt.2021.3106515
Kemal Aygun , Xu Chen

In a time where the demands for electronic systems and components are rising in an unprecedented fashion, the complexity for designing these components and systems is increasing at a similar pace. From wearable and handheld devices to autonomous vehicles to data centers and supercomputers, the growing amount of integration and the demand for more efficient access to ever-increasing data are pushing the state-of-art design methods to their limits. In this environment, innovative research is necessary to push the capability of electrical modeling and validation methods in order to equip the electronic design community with the most adequate tools to tackle the emerging challenges.

中文翻译:

前言 “电子封装和系统的电气建模和验证方面的进展”专节

在对电子系统和组件的需求以前所未有的方式增长的时代,设计这些组件和系统的复杂性也在以类似的速度增加。从可穿戴和手持设备到自动驾驶汽车,再到数据中心和超级计算机,越来越多的集成以及对更有效地访问不断增加的数据的需求正在将最先进的设计方法推向极限。在这种环境下,需要创新研究来推动电气建模和验证方法的能力,以便为电子设计界提供最合适的工具来应对新出现的挑战。
更新日期:2021-09-14
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