A new type of phosphonium ionic liquid (trihexyl (tetradecyl) phosphonium bis(2,4,4-trimethylpentyl) phosphinate core/silica shell microcapsules (IL@SiO₂) was successfully synthesized by one pot sol-gel process in IL/H₂O emulsion and combined to epoxy amine networks as reinforcing fillers. Different amounts of IL@SiO₂microcapsules and epoxy-to- amine stoichiometric ratios were considered in order to investigate the mechanical and thermal properties of IL@SiO₂ filled epoxy composites. It has been found that IL@SiO₂could be easily well dispersed in the epoxy matrix and low amounts of microcapsules can improve modulus and fracture toughness of epoxy-IL@SiO₂ composites without damaging thermal properties. This reinforcement effect could be also observed when the epoxy-to-aminohydrogen ratio is over 1.0. This study is a preliminary work combining these new microcapsules with thermosetting polymers and give inspirations for the design of functional new epoxy-based materials.

采用一锅溶胶-凝胶法在IL/H _{2 中}成功合成了新型鏻离子液体（三己（十四烷基）双（2,4,4-三甲基戊基）次膦酸核/二氧化硅壳微胶囊（IL@SiO ₂）O 乳液并结合环氧胺网络作为增强填料。考虑不同量的 IL@SiO ₂微胶囊和环氧与胺的化学计量比，以研究 IL@SiO ₂填充的环氧复合材料的机械和热性能。发现IL@SiO ₂可以很容易地很好地分散在环氧树脂基体中，少量的微胶囊可以提高环氧树脂-IL@SiO _{2 的}模量和断裂韧性不破坏热性能的复合材料。当环氧树脂与氨基氢的比率超过 1.0 时，也可以观察到这种增强效果。这项研究是将这些新型微胶囊与热固性聚合物相结合的初步工作，并为功能性新型环氧基材料的设计提供了灵感。