The mechanical properties of high-purity asymmetric rolled copper foils under cryogenic-temperature and room-temperature conditions are studied. The experimental results show that the ultimate tensile stress of the foils increases to a certain value (rolling reduction ratio ≈80%) and then decreases with a decrease in thickness when the tensile tests are carried out in the room-temperature environment, which monotonically increases with the decrease in the foil thickness when the tensile tests are carried out in a cryogenic environment. The effect on the tensile strength of the copper foil is related to the intrinsic microstructural parameters, such as the dislocation density, grain boundary spacing, and dislocation source. The tensile test results at room and cryogenic temperatures reveal that the elongation decreases with an increase in the rolling reduction ratio. Interestingly, the copper foils of the tensile test at the cryogenic temperature exhibit better elongation than that at the room temperature.

中文翻译：

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低温和室温环境中轧制铜箔的机械性能

研究了高纯不对称压延铜箔在低温和室温条件下的力学性能。实验结果表明，在室温环境下进行拉伸试验时，箔的极限拉伸应力增加到一定值（压下率≈80%），然后随着厚度的减小而减小，单调增加当在低温环境中进行拉伸试验时，随着箔厚度的减小。对铜箔抗拉强度的影响与固有的微观结构参数有关，如位错密度、晶界间距和位错源。在室温和低温下的拉伸试验结果表明，伸长率随着压下率的增加而降低。有趣的是，低温拉伸试验的铜箔表现出比室温下更好的伸长率。