当前位置: X-MOL 学术Nanotechnology › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
A low-cost and high-efficiency method for four-inch silicon nano-mold by proximity UV exposure
Nanotechnology ( IF 3.5 ) Pub Date : 2021-11-25 , DOI: 10.1088/1361-6528/ac25ab
Lei Sun 1 , Helin Zou 2, 3 , Shengbo Sang 1
Affiliation  

Nano-mold is an essential tool for nano-imprinting. However, large-area nano-mold fabrication relies on expensive equipment or complicated processing. Silicon nano-molds were achieved by proximity ultraviolet lithography and reactive ion etching (RIE). By optimizing the parameters in the processes of exposure, development, and RIE, silicon nano-mold with nano-scale ridges were fabricated with high-precision. The achieved minimum width of nano-ridges was 263 nm. This method is capable of fabricating silicon nano-mold covering four-inch wafer, which is simple, efficient and free from costly equipment.



中文翻译:

一种低成本、高效率的近紫外曝光四英寸硅纳米模具方法

纳米模具是纳米压印必不可少的工具。然而,大面积纳米模具制造依赖于昂贵的设备或复杂的工艺。硅纳米模具是通过近紫外光刻和反应离子蚀刻 (RIE) 实现的。通过优化曝光、显影和RIE过程中的参数,高精度地制造出具有纳米级脊的硅纳米模具。实现的纳米脊的最小宽度为 263 nm。该方法能够制作覆盖四英寸晶圆的硅纳米模具,简单、高效、无需昂贵的设备。

更新日期:2021-11-25
down
wechat
bug