To achieve a high thermal conductivity, thermally conductive polymer composites have been recently exploited, focusing on connecting a 3D network of thermally conductive fillers by applying external pressure or constructing a pre-made 3D filler framework to reduce phonon scattering within the polymer matrix. However, these approaches severely restrict the use of polymers, particularly epoxy composites, in many commercial applications such as the thermal management of electronic device packaging. In this study, a high-thermal-conductivity epoxy composite is fabricated by incorporating hexagonal boron nitride (h-BN) decorated with tin nanoparticles (Sn NPs). Under a hybrid filler (Sn NPs on h-BN) loading (68 wt %), the composite exhibits a high thermal conductivity of 11.9 ± 0.29 W m⁻¹ K⁻¹ while maintaining a relatively low dielectric constant (D_k ∼ 7.52) and loss (D_f ∼ 0.023) at 1 MHz with a coefficient of thermal expansion of 34 ppm °C⁻¹. The Sn NPs on h-BN in the epoxy resin matrix are thermally percolated by the in-situ growth of Sn NPs under carefully controlled curing temperature and time, resulting in significantly improved thermal conductivity of the epoxy composite under pressure-less curing conditions.

为了实现高导热性，最近开发了导热聚合物复合材料，重点是通过施加外部压力或构建预制 3D 填料框架来连接导热填料的 3D 网络，以减少聚合物基质内的声子散射。然而，这些方法严重限制了聚合物，特别是环氧复合材料在许多商业应用中的使用，例如电子设备封装的热管理。在这项研究中，通过加入用锡纳米颗粒 (Sn NPs) 装饰的六方氮化硼 ( h- BN)来制造高导热性环氧树脂复合材料。在混合填料（h -BN上的 Sn NPs ）负载（68 wt%）下，复合材料表现出 11.9 ± 0.29 W m 的高导热率^-1  K ^{-1 ，}同时 在 1 MHz 下保持相对较低的介电常数 (D _k  ∼ 7.52) 和损耗 (D _f ∼ 0.023)，热膨胀系数为 34 ppm °C ^-1。上Sn的纳米粒ħ在环氧树脂基质-BN被热通过仔细控制固化的温度和时间下的Sn NP的原位生长渗滤，从而在环氧复合材料的显著改进的热传导无压固化条件下。