Wire - arc additive manufacture (WAAM) is suitable for Inconel 718 components due to its high deposition efficiency. However, large columnar dendrites decrease the mechanical properties and can cause severe mechanical anisotropy. Cold rolling and warm rolling through flame heating have been investigated to analyze their effects on microstructure and tensile properties compared to as-deposited WAAM material. Standard solution and double aging (SA), as well as homogenization followed by solution and aging (HSA) heat treatments were compared. The results show that the large columnar dendrites change to finer equiaxed grains 16.4 μm and 26.2 μm in size for warm and cold rolled alloy, respectively. This increases to 22.5 μm and 30.1 μm after HSA treatment. The microhardness and strength of rolled material increase significantly and the warm rolled material after HSA treatment exceeds that of the wrought alloy. While the as-deposited and cold rolled samples both show significant anisotropy, isotropic tensile properties are obtained for warm rolled plus HSA heat treated samples. Finer equiaxed grains with more dispersive distributions of γ' and γ" strengthening precipitation contribute to the superior mechanical properties for warm rolled material. For both the cold and warm rolled material, there was an elongation decrease due to precipitated particles, which also led to a trans-granular ductile fracture mode. The strengthening mechanism of the hybrid rolling process was analyzed and found to be related to work hardening, grain boundary strengthening, precipitated strengthening phases and the δ phase.

由于其高沉积效率，线弧增材制造 (WAAM) 适用于 Inconel 718 组件。然而，大的柱状枝晶会降低机械性能，并会导致严重的机械各向异性。已经研究了冷轧和通过火焰加热的温轧，以分析与沉积的 WAAM 材料相比，它们对微观结构和拉伸性能的影响。比较了标准溶液和双时效 (SA) 以及均质化后的溶液和时效 (HSA) 热处理。结果表明，对于温轧和冷轧合金，大的柱状枝晶转变为更细的等轴晶粒，尺寸分别为 16.4 μm 和 26.2 μm。在 HSA 处理后，这增加到 22.5 μm 和 30.1 μm。轧材的显微硬度和强度显着提高，经过HSA处理的温轧材超过了锻制合金。虽然沉积态和冷轧样品都显示出显着的各向异性，但温轧加 HSA 热处理的样品获得了各向同性的拉伸性能。更细的等轴晶粒和更分散的γ'和γ"强化析出有助于温轧材料具有优异的力学性能。对于冷轧和温轧材料，由于析出颗粒，伸长率降低，这也导致了跨晶韧性断裂模式。分析了混合轧制过程的强化机制，发现与加工硬化、晶界强化、