Isocyanate terminated poly (ether ether ketone)–polymers (PEEK-NCO) were synthesized from phenolic hydroxyl functionalized poly ether ether ketone (PEEKTOH) and tolylene diisocyanate (TDI) and characterized. The PEEK-NCO polymers were then reacted with diglycidyl ether of bisphenol A (DGEBA) to form copolymers containing varying proportions of thermoplastic PEEK segments linked to DGEBA through urethane bridges. Room temperature curable, tough adhesive formulations were processed using these copolymers along with triethylenetetramine (TETA) as the curing agent. Complex viscosity, gelation time, storage modulus and loss modulus of the adhesive formulations were evaluated under isothermal conditions. Adhesive strength of the formulations was evaluated on aluminium substrates at 25 °C, 100 °C and −196 °C and the results were correlated to the composition. Cured adhesive samples were cryogenically fractured and the fracture morphologies were investigated using scanning electron microscopy. Dynamic mechanical thermal analysis was performed to understand the visco-elastic properties of the cured adhesive formulations. The PEEK- modified epoxy adhesive systems exhibited enhanced glass transition temperatures in the range of 88–90 °C vis a vis the unmodified epoxy (80 °C) and offered a broad service temperature capability from −196 °C to 100 °C.

异氰酸酯封端的聚（醚醚酮）-聚合物（PEEK-NCO）由酚羟基官能化聚醚醚酮（PEEKTOH）和甲苯二异氰酸酯（TDI）合成并表征。然后将 PEEK-NCO 聚合物与双酚 A 的二缩水甘油醚 (DGEBA) 反应形成共聚物，该共聚物包含不同比例的热塑性 PEEK 链段，这些链段通过氨基甲酸乙酯桥连接到 DGEBA。使用这些共聚物以及作为固化剂的三亚乙基四胺 (TETA) 处理室温可固化、坚韧的粘合剂配方。在等温条件下评估了粘合剂配方的复数粘度、胶凝时间、储能模量和损耗模量。配方的粘合强度在 25 °C 下在铝基材上进行评估，100 °C 和 -196 °C，结果与成分相关。固化的粘合剂样品进行低温断裂，并使用扫描电子显微镜研究断裂形态。进行动态机械热分析以了解固化粘合剂配方的粘弹性。与未改性环氧树脂 (80 °C) 相比，PEEK 改性环氧树脂粘合剂系统的玻璃化转变温度提高了 88–90 °C，并提供了从 -196 °C 到 100 °C 的广泛使用温度能力。