Surface Engineering ( IF 2.8 ) Pub Date : 2021-09-08 , DOI: 10.1080/02670844.2021.1976013 Xiaofei Xu 1 , Zengwei Zhu 1 , Ziming Xue 1 , Xiaofei Zhan 1
ABSTRACT
Ultrafine-grained (UFG) Cu deposits were prepared using pulse electrodeposition assisted by hard particle friction under strong cathodic polarisation in an additive-free bath. The effects of hard particle friction on the resulting electrochemical behaviour, microstructure, and mechanical properties of the deposits were studied. The results demonstrate that friction can effectively weaken the concentration polarisation and maintain the stability of the cathodic polarisation process. Periodic growth inhibition and the promotion of lateral growth owing to the applied friction lead to the formation of finer equiaxed grains (130 ± 5 nm). The UFG Cu deposits produced using friction-assisted pulse electrodeposition had a preferential (111) orientation, compared to a (220) orientation in deposits produced using conventional pulse electrodeposition. The corresponding tensile strength was 630 ± 15 MPa and the elongation to failure was 14.5 ± 2.5%. The hardness and surface roughness were 183–204 HV and Ra 46 ± 5 nm, respectively.
中文翻译:
高性能超细晶粒铜沉积物的摩擦辅助脉冲电沉积
摘要
超细晶粒 (UFG) 铜沉积物是在无添加剂浴中使用强阴极极化下硬质颗粒摩擦辅助的脉冲电沉积制备的。研究了硬质颗粒摩擦对沉积物电化学行为、微观结构和机械性能的影响。结果表明,摩擦能有效减弱浓差极化,保持阴极极化过程的稳定性。由于施加的摩擦,周期性的生长抑制和横向生长的促进导致形成更细的等轴晶粒 (130 ± 5 nm)。与使用传统脉冲电沉积生产的沉积物的 (220) 取向相比,使用摩擦辅助脉冲电沉积生产的 UFG Cu 沉积物具有优先 (111) 取向。相应的抗拉强度为 630 ± 15 MPa,断裂伸长率为 14.5 ± 2.5%。硬度和表面粗糙度分别为 183-204 HV 和 Ra 46 ± 5 nm。