Hermetic sealing is important regarding functionality and reliability for MEMS components. Typically this sealing is done at the wafer level using wafer bonding, which simultaneously provides mechanical protective caps. Here, a universally usable MEMS Foundry technology for inertial sensors and the glass frit bonding to seal them are introduced. A test structure for inner cavity pressure measurement, utilizing the pressure dependence of heat transfer in gasses, which can be realized in this MEMS technology, is introduced and described for use in detailed investigations of factors, which influence the inner cavity pressure in the wafer pre-processing and wafer bonding step itself. These investigations ultimately allowed optimized wafer processing, improved process control, and reliability investigation. We show how, based on the inner cavity pressure measurements, the glass frit bond process can be set up, that side effects such as storing times of the glass frit can be understood, how fine tuning of the bond process can be done, and how both process stability and device reliability can be efficiently be proven.

气密密封对于 MEMS 组件的功能和可靠性很重要。通常，这种密封是使用晶圆键合在晶圆级完成的，同时提供机械保护帽。在这里，介绍了一种用于惯性传感器的通用 MEMS Foundry 技术和用于密封它们的玻璃料粘合。介绍并描述了一种利用气体传热的压力依赖性进行内腔压力测量的测试结构，该结构可以在该 MEMS 技术中实现，用于详细研究影响晶圆预制件内腔压力的因素。 -处理和晶片键合步骤本身。这些调查最终实现了优化的晶圆加工、改进的过程控制和可靠性调查。我们展示了如何，