This paper presents an experimental study of Cu-Mo alloys prepared by powder metallurgy (PM) method. Also, improving the dispersion and wettability of Mo in the Cu matrix was aimed. Mo particles were added by 0.24, 0.48, 0.73 and 0.97% volume fraction to Cu powder. The mixture was mechanically milled by planetary ball mill at a rotational speed of 140 rpm for 24 h under hydrogen atmosphere, with milling ball size of ∼25 times the size of the metal powders. Liquid acetone was utilized as a process control agent (PCA). Paraffin wax (0.5 wt%) was used to decrease the friction with die during the compaction process. The mixture of the blended powder was compacted at ambient temperature under three different pressures (400, 600 and 800 MPa) and then sintered in a vacuum furnace at 1000 C for 1 h by a heating rate of 5 C min⁻¹. The microstructure examination showed a homogeneous dispersion of Mo particles within the Cu matrix with no evidence of new phases formation during the sintering process. Also, the relative density of samples has been increased by increasing both of Mo content and the compaction pressure. The results revealed that the compaction pressure of 600 MPa was the most suitable pressure as it gave the highest densification. Cu—0.97% volume fraction Mo alloy samples exhibited finer Mo particles with a homogenous distribution in the Cu matrix and well bonding with the Cu particles. The microhardness was increased gradually by increasing Mo wt%, while the compressive strength was decreased by increasing the Mo contents. Both the electrical and thermal conductivities were decreased gradually by the addition of Mo. While the coefficient of thermal expansion (CTE) was decreased by Mo addition.

本文介绍了通过粉末冶金 (PM) 方法制备的 Cu-Mo 合金的实验研究。此外，还旨在提高 Mo 在 Cu 基体中的分散性和润湿性。Mo 颗粒以 0.24、0.48、0.73 和 0.97% 的体积分数添加到 Cu 粉末中。混合物在氢气气氛下通过行星式球磨机以 140 rpm 的转速机械研磨 24 小时，研磨球尺寸约为金属粉末尺寸的 25 倍。液体丙酮用作过程控制剂 (PCA)。石蜡 (0.5 wt%) 用于减少压实过程中与模具的摩擦。将混合粉末的混合物在三种不同压力（400、600 和 800 MPa）下在环境温度下压实，然后在真空炉中以 5 C min ^-1的加热速率在 1000 C 下烧结 1 h. 微观结构检查表明，Mo 颗粒在 Cu 基体中均匀分散，在烧结过程中没有形成新相的迹象。此外，通过增加 Mo 含量和压实压力，样品的相对密度也增加了。结果表明，600 MPa 的压实压力是最合适的压力，因为它提供了最高的致密化。Cu-0.97% 体积分数 Mo 合金样品表现出更细的 Mo 颗粒，在 Cu 基体中分布均匀，并且与 Cu 颗粒结合良好。随着Mo wt%的增加，显微硬度逐渐增加，而随着Mo含量的增加，抗压强度逐渐降低。加入Mo后，电导率和热导率均逐渐降低。