Micromachining has evolved into a key facilitating technology and is widely employed today for the creation of complex micro/nano surface features for the parts used in various industries like nano/micro electro-mechanical systems, medical and telecommunications. At present fiber lasers have made an increasingly significant contribution to micro-fabrications to generate intricate shapes. The increased usage of copper in micro-domains is attributed to the advancements in personal computing and telecom industry. Against this backdrop, this work focuses upon the production of micro-grooves on the surfaces of copper/nano-boron carbide (Cu-B₄C) metal matrix nanocomposites (MMNCs) by 10 μm fiber laser spot beam. To begin with, Cu-B₄C MMNCs were synthesized through the powder metallurgical route. Response Surface Methodology-I optimal design was then attempted to optimize the laser machining factors like laser power, number of passes, scanning speed and frequency with the intention to obtain the least surface roughness, minimum kerf width, lower heat affected zone, higher depth and higher material removal. An atomic force microscope is used to inspect the surface characteristics by measuring the roughness values of the surfaces adjacent to the top of micro-grooves. A 3D surface profiler investigated the depth of the groove produced by the fiber laser. Results indicate that a minimum surface roughness of 23.06 nm and a minimum kerf width of 35.49 μm are obtained in the run order 2. Similarly, the groove with a maximum depth of cut of 245.87 μm is achieved in the run order 3. Scanning electron microscopy images helped to examine the surface morphologies and heat-affected zone of the micro-grooved samples.

微加工已发展成为一项关键的促进技术，如今广泛用于为各种行业（如纳米/微机电系统、医疗和电信）中使用的零件创建复杂的微/纳米表面特征。目前，光纤激光器对产生复杂形状的微加工做出了越来越重要的贡献。铜在微域中的使用增加归因于个人计算和电信行业的进步。在此背景下，这项工作侧重于生产铜/纳米碳化硼（CU-B的表面上的微凹槽的₄ C）的金属基质复合材料（MMNCs）由10 μ米光纤激光点束。首先，Cu-B ₄C MMNCs是通过粉末冶金路线合成的。响应表面方法-I 优化设计然后尝试优化激光加工因素，如激光功率、通过次数、扫描速度和频率，目的是获得最小的表面粗糙度、最小的切口宽度、更低的热影响区、更高的深度和更高的材料去除率。原子力显微镜用于通过测量与微槽顶部相邻的表面的粗糙度值来检查表面特性。3D 表面轮廓仪研究了光纤激光器产生的凹槽深度。结果表明，最小表面粗糙度为 23.06 nm，最小切口宽度为 35.49 μm 是在运行顺序 2 中获得的。同样，在运行顺序 3 中实现了最大切割深度为 245.87 μ m的凹槽。扫描电子显微镜图像有助于检查微观结构的表面形貌和热影响区。凹槽样品。