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Nanomolding of Gold and Gold–Silicon Heterostructures at Room Temperature
ACS Nano ( IF 17.1 ) Pub Date : 2021-09-02 , DOI: 10.1021/acsnano.1c02636
Arindam Raj 1 , Naijia Liu 1 , Guannan Liu 1 , Sungwoo Sohn 1 , Junxiang Xiang 2 , Ze Liu 2 , Jan Schroers 1
Affiliation  

Nanofabrication techniques are limited by at least one of the required characteristics such as choice of material, control over geometry, fabrication requirements, yield, cost, and scalability. Our previously developed method of thermomechanical nanomolding fulfills these requirements, although it requires high processing temperatures. Here, we demonstrate low-temperature molding where we utilize the enhanced diffusivity on “eutectic interfaces”. Gold nanorods are molded at room temperature using Au–Si alloy as feedstock. Instead of using alloy feedstock, these “eutectic interfaces” can also be established through a feedstock–mold combination. We demonstrate this by using pure Au as feedstock, which is molded into Si molds at room temperature, and also the reverse, Si feedstock is molded into Au molds forming high aspect ratio Au–Si core–shell nanorods. We discuss the mechanism of this low-temperature nanomolding in terms of lower homologous temperature at the eutectic interface. This technique, based on enhanced eutectic interface diffusion, provides a practical nanofabrication method that eliminates the previous high-temperature requirements, thereby expanding the range of the materials that can be practically nanofabricated.

中文翻译:

室温下金和金-硅异质结构的纳米成型

纳米制造技术至少受到所需特性之一的限制,例如材料的选择、几何形状的控制、制造要求、产量、成本和可扩展性。我们之前开发的热机械纳米成型方法满足了这些要求,尽管它需要很高的加工温度。在这里,我们展示了低温成型,其中我们利用了“共晶界面”上增强的扩散率。金纳米棒在室温下使用 Au-Si 合金作为原料成型。除了使用合金原料,这些“共晶界面”也可以通过原料-模具组合来建立。我们通过使用纯金作为原料来证明这一点,在室温下将其模制成硅模具,反之亦然,硅原料被模制成金模具,形成高纵横比的金-硅核-壳纳米棒。我们根据低共晶界面的同源温度讨论了这种低温纳米成型的机制。这种基于增强共晶界面扩散的技术提供了一种实用的纳米制造方法,消除了以前的高温要求,从而扩大了可以实际纳米制造的材料范围。
更新日期:2021-09-28
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