Plastic-based electronics fill the gaps in conventional rigid silicon-based devices toward the applications in soft interfaces. However, people in the future should also consider their potential environmental impact if tons of non-degradable plastics are applied. Silk fibroin is a superior substrate alternative for the development of “green” electronics; whereas, the brittleness of silk films is still a major limitation impeding their practical use. Different from the widely reported polyphasic composite approaches, here a trace-ion-assisted plasticization strategy is developed, and shape-engineerable pure silk fibroin paper (PSFP) is prepared for the first time, which can be engraved and crumpled like a sheet of paper in the dry state. The PSFPs exhibit higher tensile fracture energy (14.4 ± 4 kJ m⁻²) than any typical plastic-electronic-substrates as far as it is known. The intrinsic brittleness of pure silk films is overcome, and the PSFP can be easily engineered to form periodic meshes, electronic prototypes, and kirigami-based devices, which are beyond the reported regenerated silk films or silk composite films. Moreover, the scrape coating method employed here is simple, highly repeatable, and suitable for scaled production of low-cost PSFP continuously. Collectively, the PSFP is generalizable to various shapes and devices, represents an ideal substrate alternative to plastic electronics.

中文翻译：

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用于塑料电子产品理想基板替代品的形状工程丝素纸

塑料基电子器件填补了传统刚性硅基器件在软界面应用方面的空白。但是，如果应用成吨的不可降解塑料，未来的人们也应该考虑它们对环境的潜在影响。丝素蛋白是开发“绿色”电子产品的优质基材替代品；然而，丝膜的脆性仍然是阻碍其实际应用的主要限制因素。与广泛报道的多相复合方法不同，这里开发了一种痕量离子辅助塑化策略，并首次制备了形状工程纯丝素纸（PSFP），它可以像一张纸一样雕刻和揉皱处于干燥状态。PSFP 表现出更高的拉伸断裂能 (14.4 ± 4 kJ m ^-2) 比已知的任何典型的塑料电子基板都要好。克服了纯丝膜固有的脆性，PSFP 可以很容易地设计成周期性网格、电子原型和基于剪纸的器件，这些都超出了报道的再生丝膜或丝复合膜。此外，这里采用的刮涂方法简单，重复性强，适合低成本 PSFP 的连续规模化生产。总的来说，PSFP 可推广到各种形状和设备，是塑料电子产品的理想基板替代品。