Abstract

The adhesion of thin silver joints sintered on metallic substrates is a major issue for their potential use in power electronics modules. Here, we explore how laser shock-induced spallation can provide a way to study this adhesion. Due to wave interactions inside the shock-loaded assembly, dynamic tensile stresses are induced near the copper-silver interface, resulting in partial or full removal of the silver layer. In order to investigate the effects of aging on the interface strength, experiments are performed on both as-sintered and aged samples. Time-resolved measurements of the free surface velocity provide information on wave dynamics and interface failure, but finite-element simulations show that inferring a quantitative value of the bonding strength from these data is still challenging. Nevertheless, post-recovery observations provide original insight into the debonding process, including some complex effects of aging, consistent with trends reported in the literature.

摘要

烧结在金属基板上的薄银接头的附着力是其在电力电子模块中潜在用途的主要问题。在这里，我们探讨了激光冲击引起的剥落如何提供一种研究这种粘附的方法。由于冲击载荷组件内部的波相互作用，在铜-银界面附近产生动态拉伸应力，导致银层部分或全部去除。为了研究老化对界面强度的影响，对烧结样品和老化样品进行了实验。自由表面速度的时间分辨测量提供了有关波动力学和界面失效的信息，但有限元模拟表明，从这些数据推断粘合强度的定量值仍然具有挑战性。尽管如此，