Metal-halide perovskites (MHPs) possess enormous potential in optoelectronic and semiconductor devices. In these applications, MHPs are often subjected to mechanical stress, resulting in distorted lattice, severe degradation, and catastrophic failure in MHPs and their interfaces. Understanding these mechanics-coupled stability issues is crucial to the durability and, thus, commercial viability of MHP-based devices. Here, we review the impact of mechanical stress on the integrity and robustness of MHP devices to provide insights into mitigating the mechanics-coupled stability issues. We start with an overview of the structure-elastic-property relationship of MHPs, after which we discuss the current understanding of the cohesive and adhesive failures within MHPs and at MHP interfaces forced by mechanical stress, respectively. We further review the chemical stability issues of MHPs and interfaces induced by the mechanical strain. Finally, we summarize the existing strategies to mitigate the mechanics-coupled stability issues and conclude with an outlook of future research directions.

金属卤化物钙钛矿（MHP）在光电和半导体器件中具有巨大的潜力。在这些应用中，MHPs 经常受到机械应力，导致 MHPs 及其界面的晶格扭曲、严重退化和灾难性故障。了解这些机械耦合稳定性问题对于基于 MHP 的设备的耐用性以及商业可行性至关重要。在这里，我们回顾了机械应力对 MHP 设备完整性和稳健性的影响，以提供有关减轻机械耦合稳定性问题的见解。我们首先概述了 MHP 的结构-弹性-性能关系，然后我们分别讨论了当前对 MHP 内和 MHP 界面处由机械应力迫使的内聚力和粘合失效的理解。我们进一步回顾了由机械应变引起的 MHP 和界面的化学稳定性问题。最后，我们总结了缓解力学耦合稳定性问题的现有策略，并总结了未来研究方向的展望。