Liquid crystal polymers (LCPs) have received extensive attention in the field of 5G electronic device packaging because of their high performance as microwave substrates and packaging materials. This article describes the use of a two-wavelength picosecond laser, with a pulse duration of 8.8 ps and a repetition frequency of 100 kHz, to perform ablation experiments on a flexible LCP copper clad laminate. By fitting the experimental results, the calculated radiation exposure was found to be 3.1 and 4.45 J/cm² at wavelengths of 1064 and 355 nm, respectively. In addition, it was revealed that the laser parameters and the material characteristics of the LCP seriously affected the quality of laser machining due to photopolymerization of the LCP at 1064 nm; in contrast, better results were obtained at 355 nm. Furthermore, the effect of scanning speed and average power on the microgroove etching process was investigated. Desirable etching results were obtained at a scanning speed of 500–700 mm/s and an average power of 2.5–3.5 W. The results of this study can be useful for the processing of LCP-encapsulated electronic devices.

中文翻译：

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使用皮秒激光器在柔性覆铜板上刻蚀微槽

液晶聚合物（LCP）因其作为微波基板和封装材料的高性能而在5G电子器件封装领域受到广泛关注。本文介绍了使用双波长皮秒激光器（脉冲持续时间为 8.8 ps，重复频率为 100 kHz）对柔性 LCP 覆铜板进行烧蚀实验。通过拟合实验结果，计算得出的辐射暴露量分别为 3.1 和 4.45 J/cm ²波长分别为 1064 和 355 nm。此外，由于LCP在1064 nm处发生光聚合，LCP的激光参数和材料特性严重影响了激光加工质量；相比之下，在 355 nm 处获得了更好的结果。此外，研究了扫描速度和平均功率对微槽蚀刻工艺的影响。在 500-700 mm/s 的扫描速度和 2.5-3.5 W 的平均功率下获得了理想的蚀刻结果。这项研究的结果可用于 LCP 封装的电子设备的加工。