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Laser Erasing and Rewriting of Flexible Copper Circuits
Nano-Micro Letters ( IF 26.6 ) Pub Date : 2021-08-31 , DOI: 10.1007/s40820-021-00714-3
Xingwen Zhou 1 , Wei Guo 1 , Peng Peng 2
Affiliation  

  • An up-bottom laser erasing process utilizing electrochemical corrosion has been integrated into the bottom-up writing process.

  • The presented erased laser writing technology exhibits excellent reproducibility for sustainable manufacturing of flexible highly conductive Cu structure.

  • The suitability of the writing-erasing-rewriting process for repairing failure patterns and reconfiguring circuits has been demonstrated.



中文翻译:

柔性铜电路的激光擦除和重写

  • 利用电化学腐蚀的自上而下激光擦除过程已集成到自下而上的写入过程中。

  • 所提出的擦除激光写入技术对于柔性高导电铜结构的可持续制造具有出色的可重复性。

  • 已经证明了用于修复故障模式和重新配置电路的写入-擦除-重写过程的适用性。

更新日期:2021-08-31
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