Highly thermostable low-k polymer films with potential applications as dielectric materials in microelectronic industry were synthesized starting from 9,9-bis[4-(3,4-dicarboxyphenoxy)phenyl]fluorene dianhydride and various diamines. A polyetherimide/silica nanocomposite film was obtained using methyltriethoxysilane as precursor of inorganic phase. The chemical structure was confirmed by FTIR and ¹H NMR spectroscopy. Water vapor's sorption capacity, thermal stability, glass transition temperature, thermal diffusivity, specific heat, thermal conductivity, and dielectric characteristics of the films were determined. All the films exhibited excellent thermal stability, with an initial decomposition temperature in the range of 500–530°C. They showed low dielectric constant of 1.98–2.86 and low dielectric loss of 0.0037–0.011, at a frequency of 1 Hz and room temperature. The subglass γ- and β-relaxations, primary α-relaxation, and conductivity relaxation processes were discussed according to the chemical structure of the samples. Quantitative structure–property relationship (QSPR) study was conducted, and linear regression models were formulated to describe the causal relationships between different parameters and polyetherimide properties.

中文翻译：

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基于含芴聚醚酰亚胺的高耐热低k聚合物薄膜的研究

以 9,9-双[4-(3,4-二羧基苯氧基)苯基]芴二酐和各种二胺为原料合成了具有作为微电子工业介电材料潜在应用的高热稳定性低 k 聚合物薄膜。使用甲基三乙氧基硅烷作为无机相的前体获得聚醚酰亚胺/二氧化硅纳米复合膜。化学结构经 FTIR 和¹H 核磁共振光谱。测定了水蒸气的吸附能力、热稳定性、玻璃化转变温度、热扩散率、比热、热导率和薄膜的介电特性。所有薄膜都表现出优异的热稳定性，初始分解温度范围为 500-530°C。它们在 1 Hz 的频率和室温下显示出 1.98-2.86 的低介电常数和 0.0037-0.011 的低介电损耗。亚玻璃γ - 和β -弛豫，初级α根据样品的化学结构讨论了-弛豫和电导弛豫过程。进行了定量结构-性能关系（QSPR）研究，并建立了线性回归模型来描述不同参数与聚醚酰亚胺性能之间的因果关系。