During curing of thermosetting polymers, crosslinking results in hardening or stiffening of the material. In electronics, for example in encapsulating integrated circuits (die bonding), thermosets are fully cured in a controlled environment (under UV-light or within a thermal oven) such that the highest stiffness possible has been achieved. In building materials, specifically in thermosets used in fastening systems (adhesive anchoring), hardening occurs at environmental temperature. Daily temperature variations alter the curing process and possibly lead to a lower stiffness. We demonstrate a modeling approach for the mechanical response dependency on the degree of cure by means of rheometer measurements under a specific temperature profile. Precisely, we perform oscillatory rheometric tests and convert the storage and loss moduli to material parameters depending on the degree of cure. Moreover, the temperature dependency as well as chemical shrinkage have been determined by the same experimental protocol. The presented approach has been applied to a commercially available (epoxy) thermoset used as an adhesive. We have observed a hardening after a gelation point of 0.7 and an adequate fit for mechanical response by polynomial functions of degree four.

在热固性聚合物的固化过程中，交联会导致材料变硬或变硬。在电子产品中，例如在封装集成电路（芯片键合）中，热固性材料在受控环境中（在紫外光下或在热烘箱内）完全固化，从而达到尽可能高的刚度。在建筑材料中，特别是在用于紧固系统（粘合剂锚固）的热固性材料中，会在环境温度下发生硬化。每日温度变化会改变固化过程，并可能导致刚度降低。我们通过特定温度曲线下的流变仪测量展示了机械响应依赖于固化程度的建模方法。恰恰，我们进行振荡流变测试，并根据固化程度将存储和损耗模量转换为材料参数。此外，温度依赖性以及化学收缩率已由相同的实验方案确定。所提出的方法已应用于用作粘合剂的市售（环氧树脂）热固性材料。我们已经观察到凝胶点为 0.7 后的硬化和四阶多项式函数对机械响应的充分拟合。